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Intel Corporation in Hillsboro, OR is seeking a Module Development Engineer for Defect Inspection to advance next-generation semiconductor inspection capabilities. You will develop, optimize, and scale defect inspection and metrology solutions for current high-volume manufacturing and future technology nodes.
The role involves cross-functional collaboration with engineering teams, suppliers, and research groups to drive yield improvements, automate inspection systems, and influence future
Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection, where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes. You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.
Work on cutting-edge semiconductor technologies
Opportunity to influence high-volume manufacturing and future nodes
Collaborative, inclusive, and innovation-driven environment
Career growth through challenging technical opportunities
Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life. See Intel Benefits for more details.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Job Type: Experienced Hire
Shift: Shift 1 (United States of America)
Primary Location: US, Oregon, Hillsboro
This role will require an on-site presence.