Modeling Engineer

Valid8 Financial, Inc.; Chandler (AZ); On-site; USD 90,000 - 130,000; Full time

Job summary

SarasMicroDevices is seeking a Modeling Engineer to develop, validate, and deploy thermo-mechanical, electrical, and multi-physical simulation models supporting advanced electronic components.

You will build physics-based predictive models, compare simulations with experimental data, and drive design decisions across product development stages in a collaborative environment.

Qualifications

• MS in relevant engineering field and related disciplines.
• 2+ years of modeling, simulation, semiconductor packaging, electronics, or advanced materials development.

Responsibilities

• Thermo-mechanical modeling.
• Develop and execute FE A simulations to predict component and substrate warpage, thermo-mechanical stress and strain.
• Interconnect and via reliability.
• Mechanical fatigue life and moisture-induced failures.
• Reflow-induced deformation and calibration/validation.

Education

M.S. in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related engineering discipline

Tools

FEA (Finite Element Analysis)

HFSS

Maxwell

SIwave

Thermomechanical

Thermal modeling

Multi-physics simulation

Electromagnetic simulation

De-embedding techniques

Resonance and impedance analysis

Job description

SarasMicroDevicesisafullyfundedstart-upcompanydevelopinginnovativepowerdeliverysolutionsenablingfurtheradvancementsandmarketadoptionofhigh-performancecomputing,AI,virtualreality,5Gandmore.Sarasisdevelopingthispioneeringtechnologyinpartnershipwithindustry-leadingFortune500companiesandotherinnovativecomputingsolutionproviderstosupportbest-in-class,energy-efficientproducts.Ourvisionistochangetheperformance-to-powerparadigmfornextgenerationcomputingsolutionsthroughheterogeneouslyintegratedSarasMicroDevicesproducts.Welookforwardtotalkingwithsmart,energetic,team-orientedprofessionalswhocangrowwithus.Weprovidecompetitivesalaryandbenefitplans,andsomeofthebestco-workersyou’llfindanywhere.OurValues:Teamwork,Execution,Accountability,Recognition,Respect.

AbouttheRole

AreyouatalentedModelingEngineerlookingforanewchallengeandanopportunitytoadvanceyourskillsandyourcareerinagreatworkingenvironment?Wehavetheperfectjobforyou!SarasMicroDevicesisseekingahighlyproactiveandskilledModelingEngineerthatisresponsiblefordeveloping,validating,anddeployingthermo-mechanical,electrical,andmulti-physicssimulationmodelsthatsupportthedesign,development,qualification,andoptimizationofadvancedelectroniccomponents.

Responsibilities:

• Thermo-MechanicalModeling
• DevelopandexecuteFEAsimulationstopredict:
• Componentandsubstratewarpage
• Thermo-mechanicalstressandstrain
• Interconnectandviareliability
• Mechanicalfatiguelife
• Moisture-inducedfailures
• Reflow-induceddeformation
• Modelreliabilityperformanceunder:
• Temperaturecycling
• Thermalshock
• Hightemperaturestorage
• Vibrationandmechanicalshock
• Correlatesimulationresultswithexperimentalandreliabilitytestdata.
• ElectricalModeling
• Developelectricalandelectromagneticmodelstopredict:
• Capacitance
• ESR
• ESL
• Resonancebehavior
• S-parameters
• Developequivalentcircuitmodelsforembeddedpassivedevicesandpackagestructures.
• Supportsignalintegrityandpowerintegrityanalysis.(SIwave)
• Buildphysics-basedpredictivemodels.
• Comparesimulationresultstomeasureddata.
• Improvemodelaccuracythroughcalibration,tuningandvalidationactivities.
• Generatesimulationmethodologies,bestpractices,andstandards.
• ProductDevelopmentSupport
• Supporttechnologydown-selectionanddesigndecisions.
• Providesimulation-drivenrecommendationstoengineeringteams.
• ParticipateinDFMEAandriskassessments.
• Supportcustomerdesignreviewsandqualificationactivities.
• ContributetoDesignRuleManualsandproductspecifications.

Qualifications:

• M.S.inMechanicalEngineering,ElectricalEngineering,MaterialsScience,Physics,orrelatedengineeringdiscipline.
• 2+yearsofexperienceinmodeling,simulation,semiconductorpackaging,electronics,oradvancedmaterialsdevelopment.

RequiredSkills:

• FiniteElementAnalysis(FEA)
• HFSS
• Maxwell
• SIwave
• Thermomechanical
• Thermalmodeling
• Multi-physicssimulation
• Electromagneticsimulation
• De-embeddingtechniques
• Resonanceandimpedanceanalysis

PreferredSkills:

• EquipmentandSoftware:
• ANSYSMechanical
• HFSS
• SIWave
• COMSOLMultiphysics
• Abaqus
• KeysightADS
• Python
• MATLAB
• JMPLTSpice

We provide competitive salary and benefit plans.

EqualOpportunityStatement

Reasonableaccommodationmaybemadetoenableindividualswithdisabilitiestoperformtheessentialfunctions.