Mechanical Thermal Engineer

PowerLattice Technologies Inc; United States; On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Health insurance

Dental plan

Vision plan

401(k)

Job summary

PowerLattice Technologies Inc is seeking a Mechanical Thermal Engineer to support the development of mechanical and thermal solutions for semiconductor packaging and AI computing platforms.

You will collaborate with thermal, structural, packaging, reliability, and manufacturing engineers to design, prototype, test, and validate components for next-generation chiplet technologies, contributing to product performance and reliability.

Qualifications

• BS or MS in Mechanical Engineering or a related engineering discipline.
• 1-3 years of experience in thermal engineering or mechanical design, product development, or related roles.
• Experience with thermal testing and simulation tools as listed.
• Strong CAD skills and GD&T knowledge.
• Excellent communication and协作能力.

Responsibilities

• Thermal design and test of heatsinks, cold plates, and package integration hardware; analyze results and support root-cause investigations.
• Create and maintain 3D CAD models, assemblies, and drawings; interface with suppliers for prototyping and sourcing.
• Collaborate with electronics hardware and packaging teams to guide thermal and mechanical needs; maintain documentation.

Education

BS or MS in Mechanical Engineering or related

Tools

FloEFD/Flotherm

ANSYS Icepak

Fluent

COMSOL

SolidWorks

Creo

Job description

Mechanical Thermal Engineer

Reports to: Sr Director Thermal Mechanical Engineering

About Us

Powerlattice is a well-funded semiconductor start-up company backed by leading Silicon Valley venture capital firms. We are developing groundbreaking chiplet power delivery technology that will transform how high-performance processors are powered, enabling the next generation of AI and advanced computing.

About the Role

We are seeking a motivated Mechanical Thermal Engineer with 1-3 years of experience to support the development of advanced mechanical and thermal solutions for semiconductor packaging and AI computing platforms. In this role, you will work closely with thermal, structural, package, reliability, and manufacturing engineers to design, prototype, test, and validate components that enable next-generation chiplet technologies. This position offers an opportunity to gain hands-on experience in thermal engineering, mechanical design, semiconductor packaging, and product development while contributing to innovative technologies for future AI infrastructure. As a Mechanical Thermal Engineer, you will contribute to the development of mechanical and thermal solutions that improve product performance, reliability, and manufacturability. Your work will support engineering teams from concept development through prototype validation and product release.

Key Responsibilities

• Thermal Engineering : Support the design and test of heatsinks, cold plates, retention mechanisms, fixtures, mechanical supports, and package integration hardware. Execute laboratory testing, collect data, and document results, Analyze test results and support root-cause investigations related to mechanical, thermal, or reliability performance. Perform basic thermal analyses under the guidance of senior engineers.
• Mechanical Engineering: Create and maintain detailed 3D CAD models, assemblies, and engineering drawings for mechanical and thermal components. Interface with suppliers and fabrication partners to support prototype builds and component sourcing. Conduct tolerance stack-up analyses and support GD&T implementation for mechanical assemblies.
• Engineering: Partner with electronics hardware and semiconductor packaging and development teams to guide thermal and mechanical needs and design. Maintain engineering documentation, test reports, specifications, and design records.

Minimum Qualifications

• This is an onsite role requiring 5 days a week onsite at our HQ's in Vancouver, WA (Greater Portland Area)
• BS or MS in Mechanical Engineering or a related engineering discipline.
• 1-3 years of experience in thermal engineering or mechanical design, product development, or related engineering roles.
• Understanding thermal testing, heat transfer fundamentals and simulation tools such as FloEFD/Flotherm, ANSYS Icepak, Fluent, COMSOL, or equivalent.
• Understanding of mechanical engineering fundamentals including structural mechanics, materials, and manufacturing processes.
• Experience with 3D CAD software such as SolidWorks, Creo or similar platforms.
• Experience creating detailed engineering drawings and applying GD&T principles.
• Strong analytical, organizational, and problem-solving skills.
• Effective written and verbal communication skills.
• Ability to work in a fast-paced, collaborative engineering environment.

Preferred Qualifications

• Exposure to semiconductor packaging, electronics hardware, data center systems, and semiconductor packaging qualification testing
• Experience using simulation tools such as FloTherm/FloEFD, Abaqus, ANSYS Icepak/Mechanical, SolidWorks Simulation, or COMSOL.
• Familiarity with thermal interface materials, heatsinks, cold plates, and electronics cooling concepts.
• Experience supporting laboratory testing, instrumentation, and prototype validation activities.
• Familiarity with manufacturing methods such as CNC machining, sheet metal forming, plastic 3D printing and metal additive manufacturing

Compensation & Benefits

• Anticipated annual base salary for Member of Technical Staff: $100,000 - $130,000
• Stock option grant
• Comprehensive benefits package including health, dental, vision, and 401(k