Mechanical Engineering Manager - Semiconductor Equipment

Veeco Instruments Inc.

Horsham (PA)

On-site

USD 125,000 - 160,000

Full time

14 days+

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Benefits offered by this job

Medical, Dental, and Vision
Employee Stock Purchase Plan (ESPP)
401(k) with Company Match
Flexible Spending Accounts (FSA)
Tuition Reimbursement

Job summary

A leading technology company in Horsham, PA seeks a Manager of Mechanical Engineering to lead the design and development of complex wafer processing equipment. Responsibilities include managing a team, defining design specifications, and ensuring project execution within budget and on time. The ideal candidate will possess strong leadership, project management skills, and experience with SolidWorks and AutoCAD. A competitive salary of $125,000-$160,000 plus bonuses, with benefits such as medical and retirement plans, is offered.

Qualifications

  • 8+ years of experience for BS or 6+ years for MS in Mechanical Engineering.
  • 5+ years people management experience.
  • Project management experience required.

Responsibilities

  • Manage Mechanical Engineering activities and supervise team.
  • Define design specifications based on customer requirements.
  • Lead team through all phases of the design process.
  • Ensure execution of programs on time and within budget.

Skills

Leadership
Project Management
SolidWorks
AutoCAD
Communication Skills

Education

BS degree in Mechanical Engineering
MS degree in Mechanical Engineering

Tools

SAP

Job description

A leading technology company in Horsham, PA seeks a Manager of Mechanical Engineering to lead the design and development of complex wafer processing equipment. Responsibilities include managing a team, defining design specifications, and ensuring project execution within budget and on time. The ideal candidate will possess strong leadership, project management skills, and experience with SolidWorks and AutoCAD. A competitive salary of $125,000-$160,000 plus bonuses, with benefits such as medical and retirement plans, is offered.
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