Mechanical Engineer Supporting ASIC Test

Anysilicon

Fort Collins (CO)

On-site

USD 110,000 - 150,000

Full time

4 days ago
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Job summary

Anysilicon is seeking a Mechanical Engineer to advance thermal management and socketing for ASIC test PCBs in hyperscale data centers. You will collaborate with PCB designers, perform 3D extractions, and drive verification using SolidWorks and Ansys tools.

The role includes profiling warpage, interfacing with device package teams, and managing external vendors, with hands-on lab testing and debugging. Experience in high-power ASIC environments is essential.

Qualifications

  • Bachelor’s or Master’s in Mechanical Engineering with relevant semiconductor experience.
  • 8+ years (Bachelor) or 6+ years (Master) in semiconductor socket and cooling solutions.

Responsibilities

  • Collaborate with PCB electrical engineers to design ASIC sockets and cooling.
  • Design and verify components in SolidWorks.
  • Perform 3D mechanical extractions from PCB design software.
  • Generate warpage profiles from simulation data with device designers.
  • Measure device warpage with profilometry to validate simulations.
  • Manage socket hardware vendors and approve designs.
  • Troubleshoot mechanical/electrical contact issues in lab/test environments.
  • Design and review cooling solutions (air/liquid/cold plate).
  • Assist procurement of mechanical and test hardware.

Skills

SolidWorks
Thermal analysis
Vendor management
Pogo-pin/socket tech
Profilometry
Python/Excel data handling
Mechanical debugging
Teamwork

Education

Bachelor’s in Mechanical Engineering (8+ yrs in semiconductor socket/cooling)
Master’s in Mechanical Engineering (6+ yrs in semiconductor socket/cooling)

Tools

Ansys Icepak
Ansys FLOW
Ansys Mechanical
SolidWorks
Allegro PCB (3D extraction)

Job description

Mechanical Engineer Supporting ASIC Test

This mechanical engineering position focuses on developing thermal management and socketing solutions for test and validation PCBs for Broadcom ASIC products, specifically aimed at hyperscale data center applications. The role is integral to advancing Broadcom's market-leading products that support the next generation of AI and cloud storage.


Responsibilities:



  • Collaborate with PCB electrical design engineers to create robust ASIC socket and thermal solutions.

  • Perform mechanical component design and verification using Solidworks.

  • Conduct 3D mechanical extractions from Allegro PCB design software.

  • Interface with device package designers to generate device warpage profiles from simulation data.

  • Measure actual device warpage using high precision profilometry equipment to validate simulations.

  • Manage socket hardware vendors, providing feedback and approving designs.

  • Troubleshoot mechanical and electrical contact issues in lab and test environments.

  • Design and review cooling solutions (air, liquid, cold plate) for test hardware.

  • Evaluate and manage procurement of mechanical and test hardware, including thermal control units and socket resistance measurement platforms.

  • Utilize 3D printing to resolve usability issues.


Qualifications:



  • Bachelor’s Degree in Mechanical Engineering with 8 years of experience or a Master’s Degree with 6 years of experience in semiconductor socket and cooling solutions.

  • In-depth experience using Solidworks.

  • Experience with Ansys Icepack and/or Solidworks FLOW for thermal analysis and simulation.

  • Experience with Ansys mechanical simulation software.

  • Experience managing vendors in the test hardware manufacturing process.


Skills:



  • Strong design ownership and collaboration skills with engineers.

  • Good mechanical prototyping skills and attention to detail.

  • Familiarity with socketing and cooling for high power, high ball-count ASIC devices.

  • Experience with pogo-pin and elastomeric IC socket solutions.

  • Mechanical debugging intuition and proficiency with basic hand tools, micrometers, and calipers.

  • Base knowledge of ATE test hardware mechanical configurations.

  • Familiarity with Keyence profilometry equipment.

  • Ability to manipulate large data sets using Excel or Python scripts.

  • Passion for continuous improvement and commitment to quality output.

  • Strong teamwork and interpersonal skills for managing vendors and internal customers.

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