Mechanical Engineer: ASIC Test & Thermal Solutions

Anysilicon; Fort Collins (CO); On-site; USD 110,000 - 150,000; Full time

Job summary

Anysilicon is seeking a Mechanical Engineer to advance thermal management and socketing for ASIC test PCBs in hyperscale data centers. You will collaborate with PCB designers, perform 3D extractions, and drive verification using SolidWorks and Ansys tools.

The role includes profiling warpage, interfacing with device package teams, and managing external vendors, with hands-on lab testing and debugging. Experience in high-power ASIC environments is essential.

Qualifications

• Bachelor’s or Master’s in Mechanical Engineering with relevant semiconductor experience.
• 8+ years (Bachelor) or 6+ years (Master) in semiconductor socket and cooling solutions.

Responsibilities

• Collaborate with PCB electrical engineers to design ASIC sockets and cooling.
• Design and verify components in SolidWorks.
• Perform 3D mechanical extractions from PCB design software.
• Generate warpage profiles from simulation data with device designers.
• Measure device warpage with profilometry to validate simulations.
• Manage socket hardware vendors and approve designs.
• Troubleshoot mechanical/electrical contact issues in lab/test environments.
• Design and review cooling solutions (air/liquid/cold plate).
• Assist procurement of mechanical and test hardware.

Skills

SolidWorks

Thermal analysis

Vendor management

Pogo-pin/socket tech

Profilometry

Python/Excel data handling

Mechanical debugging

Teamwork

Education

Bachelor’s in Mechanical Engineering (8+ yrs in semiconductor socket/cooling)

Master’s in Mechanical Engineering (6+ yrs in semiconductor socket/cooling)

Tools

Ansys Icepak

Ansys FLOW

Ansys Mechanical

SolidWorks

Allegro PCB (3D extraction)

Job description

Anysilicon is seeking a Mechanical Engineer to advance thermal management and socketing for ASIC test PCBs in hyperscale data centers. You will collaborate with PCB designers, perform 3D extractions, and drive verification using SolidWorks and Ansys tools.

The role includes profiling warpage, interfacing with device package teams, and managing external vendors, with hands-on lab testing and debugging. Experience in high-power ASIC environments is essential.