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Image Associates Inc. designs and documents enclosures, chassis, thermal solutions, and harness assemblies for military-grade electronics, focusing on shock, vibration, EMI, grounding, and environmental sealing requirements.
The role builds prototypes and supports MIL-STD-810/461 qualification testing, including test fixtures, test plans, and root-cause analysis of failures to improve designs and reliability.
Design and document enclosures, chassis, thermal solutions, and cable and wire harness assemblies for military-grade electronic products, addressing shock, vibration, EMI, grounding, and environmental sealing requirements. Build prototypes and plan and support MIL-STD-810 and MIL-STD-461 qualification testing, including test fixtures, test plans, and failure root-cause analysis.
Requirements: A bachelor's degree in Mechanical Engineering and 4–8 years of experience in electronics packaging design are required. Candidates should have working knowledge of Design for Manufacturing and GD&T, strong 3D design skills using SolidWorks or ANSYS, and thermal, structural, and vibration analysis skills.
Key Skills: Mechanical Engineering, Electronics Packaging Design, SolidWorks, ANSYS, Design for Manufacturing, Geometric Dimensioning and Tolerancing (GD&T), Thermal Analysis, Structural Analysis, Vibration Analysis, Shock and Vibration Design, EMI Shielding and Grounding, Environmental Sealing, Cable and Wire Harness Design, 3D Printing, Prototype Development, Qualification Testing