Materials Research Engineer

Intel; Hillsboro (OR); Hybrid; USD 122,000 - 232,000; Full time

Job summary

Intel is seeking a College Grad research-focused role in Hillsboro, Oregon. This hybrid position combines on-site experimentation with remote collaboration to advance semiconductor device technology and packaging.

The candidate will work across lithography, etch, CVD, PVD, bonding, and CMP while mentoring partners and managing vendor relationships. Requires a PhD in a related field, plus demonstrated publications and experience with deposition, metrology, or process hardware.

Qualifications

• PhD degree in Materials Science, Chemistry, Physics, Chemical Engineering or related field.
• Lead- and co-authored research publications in peer reviewed journals and/or Conferences.
• 6+ months of experience with deposition processes, metrologies, process hardware, or project development.

Responsibilities

• Develops innovative solutions to support Intel's future technology roadmap.
• Drives design, simulation, development, and implementation activities for scientific research projects leveraging device physics, materials, chemistry, and process innovations to drive research on novel devices, packages, interconnects, circuits, and systems.
• Evaluates device, circuit, and system tradeoffs to identify solutions for continued performance improvements.
• Drives process and equipment research to enable device miniaturization and high-volume manufacturing.
• Provides process solutions across fabrication modules including lithography, etch, CVD, PVD, bonding, and CMP.
• Plans and executes experiments across fabrication sites in collaboration with cross-functional teams; benchmarks results against industry standards.
• Develops and validates models and measurements to advance device physics and packaging understanding.
• Manages vendor relationships supporting R&D across devices, packages, and interconnects.
• Mentors academic and industry partners to strengthen Intel's research pipeline.

Skills

Research publications

Deposition processes

Metrology tools

Process hardware

Project development

Education

PhD in Materials Science, Chemistry, Physics, Chemical Engineering or related field

Job description

Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art, from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Foundry Organization are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

Job Details

Job Description:

Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art, from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Foundry Organization are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

Please Note: This role is a Hybrid role that requires 4 days onsite, 1 day working from home.

About The Role

• Develops innovative solutions to support Intel's future technology roadmap.
• Drives design, simulation, development, and implementation activities for scientific research projects leveraging device physics, materials, chemistry, and process innovations to drive research on novel devices, packages, interconnects, circuits, and systems.
• Evaluates device, circuit, and system tradeoffs to identify solutions for continued performance improvements.
• Drives process and equipment research to enable device miniaturization and high-volume manufacturing.
• Provides process solutions across fabrication modules including lithography, etch, CVD, PVD, bonding, and CMP.
• Plans and executes experiments across fabrication sites in collaboration with cross-functional teams; benchmarks results against industry standards.
• Develops and validates models and measurements to advance device physics and packaging understanding.
• Manages vendor relationships supporting R&D across devices, packages, and interconnects.
• Mentors academic and industry partners to strengthen Intel's research pipeline.

Qualifications

The Minimum qualifications listed below are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience, academic projects, and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• PhD degree in Materials Science, Chemistry, Physics, Chemical Engineering, Electrical Engineering or related field.
• Lead- and co-authored research publications in highly regarded, peer reviewed scientific journals and/or Conferences.
• 6+ months of experience with one or more of the following (having more than one will be preferred):
• Developing/maintaining deposition processes.
• Use of multiple metrologies to efficiently drive process improvement.
• Developing/maintaining process hardware.
• Project development in a team environment.

Preferred Qualifications

• Thorough understanding of how to monitor and control processes.
• Working knowledge of standard semiconductor processes.
• Experience with modifying and controlling film properties to improve ease of integration.
• Experience with electrical test metrics and integration schemes.
• Experience with automating common tasks within automation systems.
• Demonstrated materials improvements from utilization of advanced AI/ML techniques.
• Previous experience in running vendor research collaborations.

Job Type

College Grad

Shift

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $122,440.00 - 232,190.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.