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Insight Global is seeking a Manufacturing Engineer for a leading precision automation and microelectronics assembly equipment manufacturer. This role acts as the primary engineering support for production teams building wire bonding and die bonding systems in a fast-paced environment.
The engineer collaborates with technicians, operations, quality, and design engineering to resolve production issues, improve processes, maintain documentation, and increase overall efficiency.
Insight Global is seeking a Manufacturing Engineer for a leading precision automation and microelectronics assembly equipment manufacturer. This individual will act as the primary engineering support resource for production teams building highly specialized wire bonding and die bonding systems. The ideal candidate is hands-on, thrives in a fast-paced manufacturing environment, and enjoys troubleshooting complex electro-mechanical systems while driving continuous improvement initiatives.
This engineer will work closely with technicians, operations, quality, and design engineering teams to resolve production issues, improve manufacturing processes, maintain documentation, and increase overall production efficiency. Additionally, the candidate will play a key role in developing technician capabilities, reducing manufacturing downtime, and ensuring high-quality, scalable assembly methods for advanced automation equipment serving aerospace, defense, medical device, photonics, and semiconductor-related industries.
This is a full-time permanent opportunity with a salary range estimated between $80K-$100K (depending on experience). Other benefits include medical benefits, health savings, 401k, as well as paid vacation, paid sick time and paid holidays. This role will be onsite 5 days a week at the Carlsbad facility.
Required Skills & Experience
• Bachelor’s degree in engineering (Mechanical, Manufacturing, Electrical, Industrial, or related).
• 2+ years of hands-on manufacturing engineering experience in a precision electro-mechanical or capital-equipment environment (semiconductor packaging equipment, high-mix low-volume assembly, or equivalent preferred).
• Demonstrated ability to troubleshoot complex electro-mechanical systems under production pressure.
• Experience creating and maintaining manufacturing documentation and ERP methods (Epicor experience is strongly preferred).
• Working knowledge of lean manufacturing principles and structured problem-solving methods (5-Why, 8D, fishbone, etc.).
• Proficiency with Microsoft Office; experience with 3D CAD (Creo preferred) is a plus.
• Strong interpersonal skills and the ability to train and influence technicians while maintaining production discipline. Clear written and verbal communication skills.