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Northrop Grumman is seeking a Manager Programs 2 to join the Microelectronics Center in Linthicum, MD. You will shape and execute advanced packaging technology development, prototype, and maturation programs, overseeing cost, schedule, and technical performance while coordinating with customers, suppliers, and internal teams.
You will lead Integrated Program Teams across the lifecycle, drive growth opportunities, and participate in bid/proposal activities.
RELOCATION ASSISTANCE: No relocation assistance available
CLEARANCE REQUIRED FOR START: Yes
CLEARANCE TYPE: Secret
TRAVEL: Yes, 10% of the Time Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Mission Systems (NGMS) Sector is seeking a Manager Programs 2 to join the Northrop Grumman Microelectronics Center (NGMC) to support the Foundry, Test, and Advanced Packaging Operating Unit's Advanced Packaging team. The position will be onsite in Linthicum, MD .
For more than 70 years, Northrop Grumman's Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.
The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our sectors and their operating divisions.
The selected candidate will be responsible for shaping, capture, and execution of advanced packaging technology development, prototyping, and maturation programs. The selected candidate will be responsible for numerous aspects of the program including: managing cost, schedule, and technical performance of the program; leading interfaces with internal and external customers, supplier partners, and company support organizations; supporting insertion of these technologies into other IRAD, CRAD, or production programs; identifying growth opportunities and play significant roles in bid and proposal activities; and interfacing with technical leadership across Northrop Grumman to identify technology needs and timelines to support next-generation systems.
Program Managers are responsible for leading all phases of the program life cycle from inception (proposal development) through startup, execution, and completion (contract closeout). Primary responsibilities are the management of cost, schedule, and technical performance of company programs or subsystems and include, but are not limited to: