Mac Reliability Engineer: Build Ultra-Robust Portables

Socket.dev; Austin (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Apple's Mac Reliability Engineering team in Austin seeks a detail‑oriented engineer to lead board‑level reliability on new Mac portables. You will develop and execute tests to quantify reliability, identify failure modes, and collaborate with hardware and design teams to drive design improvements.

You will apply FMEA, DOE, and advanced failure analysis techniques (X-ray, optical microscopy, SEM/EDS) to uncover root causes and influence packaging and assembly decisions for product robustness

Qualifications

• MS in Materials Science, Electrical, Mechanical Engineering or equivalent with 2+ years of relevant engineering experience
• Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing
• Ability to use failure analysis methods to derive root causes, with knowledge of failure modes and life data analysis
• Knowledge of board level design, DFM and reliability best practices for component selection and placement
• Strong knowledge of Semiconductor package integration, SLI reliability, passive components and warpage control
• Ability to apply FMEA (Failure Modes and Effects Analysis)

Responsibilities

• Lead board-level reliability on new Mac portables
• Develop new test procedures to quantify design reliability
• Perform failure analysis resulting from tests
• Collaborate with design teams to drive product improvements

Skills

Board-level reliability testing

Failure analysis

FMEA

Statistical life data analysis

DFM knowledge

Strong communication

Education

MS in Materials Science

MS in Electrical Engineering

MS in Mechanical Engineering

Equivalent field

Tools

X-Ray

SEM/EDS

Optical Microscopy

CSAM

Job description

Apple's Mac Reliability Engineering team in Austin seeks a detail‑oriented engineer to lead board‑level reliability on new Mac portables. You will develop and execute tests to quantify reliability, identify failure modes, and collaborate with hardware and design teams to drive design improvements.

You will apply FMEA, DOE, and advanced failure analysis techniques (X-ray, optical microscopy, SEM/EDS) to uncover root causes and influence packaging and assembly decisions for product robustness