Low Yield Analysis Engineer on Shift

Intel; Hillsboro (OR); On-site; USD 99,000 - 140,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel in Hillsboro, Oregon seeks an Experienced LYA Engineer to support back-end package assembly and wafer-level testing. The role focuses on design, test, checkout, and characterization of assembly technologies in a lab-based, on-site environment.

You will set priorities, drive results across boundaries, and work with internal teams and external partners to identify root causes of in-line failures and improve yield with innovative techniques.

Qualifications

• Bachelor's or Master's in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry/Physics or related field.
• Experience in a lab environment is preferred.
• Experience with destructive and optical analysis techniques (SEM, x-ray, microscopy, CSAM, ion milling, TEM, FIB).
• Experience with electrical fault isolation and failure analysis using hand probe, curve trace, auto probing, TDR, EOTPR, EBAC, RIDR, ELITE.
• Knowledge of packaging or die mapping software (Mentor Graphics, SysNav/CadNav, FIELD) and SQL/JMP is a plus.

Responsibilities

• Work across team boundaries to achieve program objectives and deliverables.
• Interface with internal teams and external suppliers to improve yield and drive innovation.
• Conduct hands-on lab work and define data acquisition and analysis plans.
• Develop failure analysis techniques and packaging improvements in manufacturing.
• Communicate findings through reports to yield engineers and customers.

Skills

Analytical skills

Problem-solving

Communication skills

Team collaboration

Adaptability

Lab experience

Education

Bachelor's Degree

Master's Degree

Tools

SEM

X-ray

TEM

FIB

Mentor Graphics

SysNav/CadNav

SQL scripting

JMP

Job description

Job Details

Job Description: APTD LYA is a Foundry Labs Network organization that supports back-end package assembly and wafer level assembly sort and test fails to help root cause yield loss and in-line failures. In this electrical-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and characterization of wafer level assembly technologies. Engineers on back or front of week shift schedules will help bridge support between engineering technicians, as well as shift 1 engineers and module partners, yield support, integration and both internal and external customers in a collaborative environment. As an LYA Engineer, you will set priorities for the platform/project, get results across boundaries, and ensure an inclusive work environment. In this role, engineers can expect to work with a team of engineers and engineering technicians to conduct various analyses and engineering tests to provide platforms with root cause determination of in-line electrical failures and perform defect and/or process characterization in support of identifying key mechanisms that contribute to root cause identification. Your main responsibilities include, but are not limited to: - Working across team boundaries to achieve strategic objectives and meet program deliverables. - Understand program milestones and schedules then translate into team objectives and drive execution. - Interface with a wide variety of internal teams, as well as external suppliers to improve yield and drive innovation. - Project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, as well as various other electronic components and/or completed units. - Conduct hands‑on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions and/or fixes to internal customers. - Develop failure analysis innovative techniques, BKMs, and/or approaches to accelerate failure identification and mechanism understanding. - Provide consultation concerning packaging and/or assembly problems and improvements in the manufacturing process. - Respond to customers' requests or events as they occur. - Candidate should be capable of working effectively across organizational boundaries. - Candidate must exhibit the following traits/skills: Work with ambiguity and flexibility with respect to job roles and working hours, have strong analytical and problem‑solving skills, and possess robust communication and presentation skills. This role is lab‑based and on‑site required.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through schoolwork and/or classes and/or project work and/or internships and/or military training and/or work experience. Minimum Qualifications: Must possess a Bachelor's Degree with at least 2 years of experience or Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field. Preferred Qualifications:

• Prior experience working in a lab environment.
• Experience with destructive and optical analysis techniques such as manual cross‑sectioning and delayering, SEM, x-ray, microscopy, CSAM, ion milling, TEM and FIB
• Experience performing electrical fault isolation and failure analysis on product and TV through the use of hand probe, curve trace, auto probing, TDR, EOTPR, EBAC, RIDR, and/or ELITE.
• Experience with chemical compositional analysis techniques such as EDX. AFM, FTIR, Raman, and diffraction techniques such as XRD and EBSD.
• Knowledge of package or die mapping software EX: Mentor Graphics, SysNav/CadNav, FIELD and expertise in SQL scripting and basic statistical analysis tools such as JMP are a plus.
• Ability to communicate findings verbally and through reports to yield engineers, LYA analysts, and other customers.
• Ability to work in a collaborative manner with a variety of different individuals in a fast paced, technical environment.
• Ability to work effectively in an ambiguous environment where changing priorities and the norm.

Job Type

Experienced Hire

Shift

Shift 7 (United States of America)

Primary Location

US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

• Annual Salary Range for jobs which could be performed in the US: $99,030.00 - 139,810.00 USD
• Work Model for this Role: This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.