Lead PCB Layout Designer – High-Speed Signal Integrity

Micron

Boise (ID)

On-site

USD 90,000 - 120,000

Full time

14 days+
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Job summary

Micron Technology in Boise, Idaho is seeking a seasoned PCB Layout Designer to lead the detailed physical layout of complex, high‑speed PCBs and perform essential pre‑engineering work such as stack‑up planning and constraints. You will collaborate with product engineering, signal integrity, mechanical, and manufacturing teams to deliver manufacturable designs using Cadence Allegro and contribute to design rule development and process improvements.

Qualifications

  • Extensive experience in PCB layout design from concept through release.
  • Strong understanding of PCB manufacturing, assembly considerations, and DFM principles.
  • Deep knowledge of high-speed PCB design, signal integrity, and power distribution networks.

Responsibilities

  • Lead PCB design from initial requirements through physical layout and release.
  • Perform pre-engineering activities: stackup planning, constraint development, floor-planning, and inputs coordination.
  • Create detailed physical layouts for complex high-speed PCBs with emphasis on signal and power integrity.
  • Demonstrate AI proficiency by using approved AI tools to enhance productivity and quality while following governance practices.
  • Collaborate with product engineering, signal integrity, mechanical, and manufacturing teams to develop robust PCB solutions.

Skills

PCB layout
Cadence Allegro
Signal integrity
High-speed design
DFM
Teamwork

Education

Bachelors in EE

Tools

Cadence Allegro

Job description

Micron Technology in Boise, Idaho is seeking a seasoned PCB Layout Designer to lead the detailed physical layout of complex, high‑speed PCBs and perform essential pre‑engineering work such as stack‑up planning and constraints. You will collaborate with product engineering, signal integrity, mechanical, and manufacturing teams to deliver manufacturable designs using Cadence Allegro and contribute to design rule development and process improvements.
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