Lead Packaging Systems Engineer — Paper & Packaging

Openkrill

United States

Remote

USD 120,000 - 190,000

Full time

14 days+

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Job summary

Foth in Wisconsin seeks a Lead Packaging Systems Engineer for Paper/General Industry to lead mechanical design on converting and packaging projects. You will develop concepts, prepare design packages, and interface with clients and vendors to ensure project success.

Responsibilities include QA/QC, design reviews, and startup support. Expect 25-35% travel and mentoring of junior engineers in a collaborative team environment.

Qualifications

  • BS Mechanical or Industrial Engineering or equivalent technical experience.
  • 10+ years of industry-relevant experience in engineering of consumer products.

Responsibilities

  • Lead and support the mechanical design effort on converting and packaging line projects.
  • Execute capital projects within scopes, costs, and schedules.
  • Develop concepts, deliverables, effort hours, and estimated cost for engineering proposals.
  • Prepare systems analysis and conceptual designs, layouts, specify equipment, and prepare detailed design packages for bid and installation on converting and packaging projects.
  • Delegate design work and mentor team members.
  • Perform QAQC of design packages.
  • Interface with clients and vendors regularly.
  • Work as part of a collaborative project team.
  • Travel to other Foth offices or client locations 25-35% annually; coach and mentor other engineers.

Skills

Leadership
Team mentoring
QAQC
Client interfacing

Education

BS Mechanical or Industrial Engineering

Tools

AutoCAD
3D design software
FlexSim
Plant Simulation
Autodesk Navisworks
ReCap

Job description

Foth in Wisconsin seeks a Lead Packaging Systems Engineer for Paper/General Industry to lead mechanical design on converting and packaging projects. You will develop concepts, prepare design packages, and interface with clients and vendors to ensure project success.

Responsibilities include QA/QC, design reviews, and startup support. Expect 25-35% travel and mentoring of junior engineers in a collaborative team environment.

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