Lead GaN Plasma Etch Process Development Engineer

Texas Instruments Incorporated

Sherman (TX)

Hybride

USD 120 000 - 180 000

Plein temps

14 jours+

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Résumé du poste

Texas Instruments Incorporated in Sherman, Texas is seeking an Advanced GaN Process Development Engineer to develop, optimize, and transfer advanced plasma etch processes for next-generation GaN devices.

You will design experiments, analyze data, and collaborate with integration, equipment, metrology, and manufacturing teams to drive process readiness for production and successful technology transfers into high-volume manufacturing.

Responsabilités

  • Develop and optimize plasma etch processes for GaN devices.
  • Design and execute DOE to improve etch rate, selectivity, and CD control.
  • Characterize process performance and establish process windows.
  • Collaborate with cross-functional teams to transfer tech to manufacturing.

Description du poste

Change the world. Love your job.
We are seeking a highly motivated Advanced GaN Process Development Engineer to join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation GaN semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing.

The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving.

The responsibilities of a Manufacturing Development Process Engineer in this role include:

    Process Development

    • Develop and optimize plasma etch processes for advanced semiconductor devices.
    • Design and execute experiments (DOE) to improve critical process metrics, including:
      • Etch rate
      • Selectivity
      • Critical dimension (CD) control
      • Profile control
      • Defectivity
      • Uniformity
    • Characterize process performance and establish process windows for manufacturing robustness.
    • Evaluate new process chemistries, hardware configurations, and chamber technologies.

    Technology Introduction

    • Support development and qualification of next-generation etch technologies.
    • Collaborate with device integration teams to meet product and technology requirements.
    • Drive process readiness for technology transfers from development into manufacturing.
    • Establish process specifications, control plans, and release documentation.

    Tool and Equipment Engineering

    • Partner with equipment engineering teams to improve tool capability, productivity, and reliability.
    • Lead chamber matching, equipment qualification, and process performance improvement activities.
    • Support installation and startup of new etch platforms.

    Data Analysis & Continuous Improvement

    • Analyze complex process datasets using statistical methods and data analytics tools.
    • Identify root causes of process excursions and implement corrective actions.
    • Lead yield improvement and defect reduction initiatives.
    • Utilize SPC methodologies to monitor and improve process stability.

    Cross-Functional Collaboration

    • Work closely with:
      • Process Integration
      • Manufacturing
      • Yield Engineering
      • Metrology
      • Equipment Engineering
      • Quality and Reliability teams
    • Present technical findings and recommendations to management and key stakeholders.
    • Mentor junior engineers and technicians as needed.
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