Lead AI Packaging Reliability Engineer

OpenAI; United States; Remote; USD 130,000 - 170,000; Full time

Job summary

OpenAI's Hardware organization seeks a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. You will assess package reliability risks from early architecture through product qualification and high-volume manufacturing, applying thermo-mechanical modeling to optimize design, materials, and assembly.

Collaborate with design, silicon, system engineering, and manufacturing teams to predict behavior and drive robust

Qualifications

• Assess package reliability risks from early architecture through product qualification and high-volume manufacturing.
• Apply thermo-mechanical modeling to optimize package design, materials and assembly processes.
• Develop reliability test plans, identify failure mechanisms and recommend corrective actions.

Responsibilities

• Lead reliability test plan and assessments for advanced HPC packages, including risk identification and mitigation planning.
• Drive reliability-focused design optimization based on thermo-mechanical modeling to improve robustness and lifetime.
• Develop, validate and apply package reliability models and lifetime-prediction.

Skills

Reliability engineering

Thermo-mechanical modeling

Root-cause analysis

Problem solving

Job description

OpenAI's Hardware organization seeks a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. You will assess package reliability risks from early architecture through product qualification and high-volume manufacturing, applying thermo-mechanical modeling to optimize design, materials, and assembly.

Collaborate with design, silicon, system engineering, and manufacturing teams to predict behavior and drive robust