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Job Purpose:
Must be able to perform all lamination functions such as operating Multi‑Bond machine, Lay‑up rigid, rigid flex and flex product, operate TMP presses, loading and unloading product using the recipe supplied on traveler, flash route after depining and breaking up the template books, clean all separator plates before lay‑up using the caul plate scrubber. Candidate must be experienced in using measuring devices such as micrometer to measure the lamination thickness of the product produced.
Rigid PCB, Flex and Rigid/Flex process knowledge. In addition it would be preferred if the candidate can demonstrate a good working knowledge of Microsoft applications (Word, Excel and PowerPoint) and the use of shop floor software to complete transactions in Oracle, Cimnet or other MRP systems. In addition, this position will require experience in the following areas: Plasma area and Hyoki clean and planarization machine.
Sanmina is an Equal Opportunity Employer.
Salary Range (annual): $52,000.00 - $54,080.00. Actual base pay within this range (determined at the offer stage) will be based on a candidate's years of relevant work experience, education, certifications, and skills, and is just one element of our total rewards package. The total rewards package also includes a variety of benefits, including health insurance coverage, life and disability insurance, savings plan, company paid holidays and paid time off (PTO) for vacation and/or personal business and, depending on the role, may include eligibility for restricted stock unit awards and participation in a discretionary bonus program.
This is an ITAR facility and applicant must be a US Citizen or a lawful permanent resident.