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Micron Technology, Inc. in Boise, Idaho invites an HBM Product & System Engineering Intern to help validate and optimize HBM devices, working with senior engineers on testing and integration for AI and HPC platforms.
You will gain hands-on experience with Python, C/C++, RTL modeling, Verilog/SystemVerilog, and FPGA lab work in a collaborative environment while developing practical problem-solving and communication skills.
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a High Bandwidth Memory (HBM) Product & System Engineering Intern, you will contribute to the validation and optimization of Micron’s HBM products —the fastest and highest-capacity HBM available. You’ll work alongside experienced engineers to develop innovative solutions for testing and integrating HBM into customer platforms, helping advance generative AI and high-performance computing.
For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.