Intern - Design Engineer, HIG HBM

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 28,000 - 48,000; Full time

Job summary

Micron Technology, Inc. is seeking an HBM Design Engineer Intern to work with memory engineers on design, simulation, and verification of HBM memory and logic circuits. You will contribute to RTL development, timing and power analysis, and functional validation in a collaborative team environment.

The internship offers exposure to industry-standard EDA tools and AI-assisted workflows to boost productivity and design quality while gaining cross-functional experience across engineering teams.

Qualifications

• Enrolled in a degree program in Electrical/Computer Engineering or related field.
• Strong foundation in digital logic, CMOS, and VLSI concepts.
• Proficiency with HDL languages and scripting for automation.

Responsibilities

• Assist design, simulation, and verification of HBM memory and logic circuits.
• Support RTL development, timing/power analysis, and functional validation.
• Develop scripts and AI-enabled workflows to improve design productivity.
• Collaborate across Design, Verification, and CAD teams during reviews and deliverables.
• Document methods, results, and insights for knowledge sharing.

Skills

Python

Perl

Tcl

C/C++

Verilog

SystemVerilog

VHDL

Education

Bachelor's/Master's/PhD in Electrical Engineering or related field

Tools

VCS

Xcelium

Questa

PrimeTime

Innovus

Virtuoso

Job description

About Micron

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data‑center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next‑generation computing systems.

Internship Overview

As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands‑on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry‑standard design methodologies, EDA tools, and cross‑functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI‑Assisted and AI‑Enabled workflows to improve engineering productivity, debug efficiency, and design quality.

Responsibilities

• Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry‑standard semiconductor design tools.
• Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities.
• Develop scripts, automation solutions, and AI‑Assisted workflows to improve design productivity, debug efficiency, and design‑flow quality.
• Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliverables.
• Document technical work, experimental results, AI‑Enabled insights, and design methodologies to support knowledge sharing and continuous improvement.

Minimum Qualifications

• Currently pursuing a Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
• Demonstrated understanding of combinational and sequential logic design concepts.
• Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work.
• Programming experience in Python, Perl, Tcl, C/C++, or similar languages, with strong analytical and problem‑solving skills.

Preferred Qualifications

• Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
• Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage concepts.
• Familiarity with Linux/Unix environments, scripting, and automation techniques.
• Exposure to semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms.
• Previous academic, research, or internship experience related to VLSI, ASIC, FPGA, semiconductor design, or Applying AI to engineering workflows and analysis.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time‑off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity Employer

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.