Advanced Packaging Technologist

Advanced Micro Devices; Austin (TX); On-site; USD 110,000 - 140,000; Full time

Job summary

A leading semiconductor company is seeking a PCB-centric Mechanical Modeling Architect in Austin, Texas. This role involves defining and driving next-generation packaging-platform architectures and requires a strong background in advanced PCB technologies and mechanical modeling. The ideal candidate should possess autonomy and collaboration skills across various engineering disciplines, alongside relevant academic credentials. This position offers the opportunity to influence product roadmaps and engage in innovative projects within a dynamic work environment.

Qualifications

• Self-directed technical leader with autonomy and clarity in communication.
• Strong background in advanced PCB technologies and assembly processes.
• Experience in modeling-driven system or platform architecture roles.

Responsibilities

• Drive model-based architecture and design decisions for advanced PCB technologies.
• Develop and maintain multi-physics models and validation strategies.
• Partner with manufacturing to optimize SMT and mechanical assembly processes.
• Engage with PCB suppliers and component vendors.

Skills

Model-based architecture

Mechanical and multi-physics modeling

Advanced PCB technologies

Collaboration across disciplines

Education

MS or PhD in Engineering or physics

Job description

Overview

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

The Role

In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply mechanical and multi-physics models to guide package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

The Person

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for STCO-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

Key Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced PCB technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
• Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
• Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies.
• Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for mechanical and PCB technology development, assess technology readiness, and influence product roadmaps.
• Serve as mechanical & multi-physics subject-matter expert for PCB and board-level architectures with a primary focus on data center platforms.

Preferred Experience

• Demonstrated experience owning model-based architecture & design decisions, supported by board-, package-, and system-level mechanical and multi-physics modeling, characterization and validation.
• Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control, and assembly constraints.
• Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first-principles understanding to multi-physics package-and-system-level design & assembly trade-offs.
• Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
• Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.

Academic Credentials

MS or PhD in relevant Engineering disciplines or physics.

Location

Austin, Texas

This role is not eligible for visa sponsorship

#LI-AJ1

Benefits and Compliance

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.