IC Packaging Engineer – WLP

Apple; Santa Clara (CA); On-site; USD 85,000 - 130,000; Full time

Job summary

An innovative technology company is seeking a dedicated IC Packaging Engineer to work on cutting-edge packaging solutions. In this role, you will lead the development of advanced packaging technologies, collaborate with multi-functional teams, and drive the integration of sophisticated package solutions. Your expertise will help shape the future of product packaging, ensuring excellence and precision in every project. If you have a passion for technology and a knack for problem-solving, this is an exciting opportunity to make a significant impact in a dynamic environment.

Qualifications

• BS degree and 3+ years of relevant industry experience required.
• Experience in Semiconductor Packaging is preferred.

Responsibilities

• Lead packaging technology development including advanced 2.5D/3D packaging.
• Work with multi-functional teams on SoC Package integration.

Skills

Attention to detail

Interpersonal skills

Problem-solving

Project management

Education

Bachelor's degree

Tools

APD

Virtuoso

Job description

IC Packaging Engineer – WLP

Santa Clara, California, United States Hardware

Summary

Posted: Mar 13, 2025

Role Number: 200577181

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention to detail and a love for excellence and precision to accomplish extraordinary results. In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, and optimize new product package structure and configuration. You will be responsible for packaging integration and package technology development for a variety of projects including SoC.

Description

1. Lead packaging technology development including advanced 2.5D/3D packaging.
2. Work with multi-functional teams and lead SoC Package integration efforts.
3. Package Architecture / Package Integration Innovation.
4. Work with foundry and OSAT to bring packaging solutions from concept to HVM.
5. Drive the industry with sophisticated Package solutions, new material development, and specs.
6. 5% International travel.

Minimum Qualifications

+ BS and 3+ years of relevant industry experience.

Preferred Qualifications

1. Experience working in the Semiconductor Packaging field.
2. Knowledge of materials characterization and analysis.
3. Proven understanding of Wafer Level Packaging, 2.5D packaging, and 3D packaging technology.
4. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
5. Excellent interpersonal skills and strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
6. Ability to work independently and orchestrate projects with minimum supervision.
7. Solution-oriented engineer with proven fundamentals in engineering and physics.
8. Capabilities using package design software, APD, Virtuoso, etc.
9. Knowledge of the latest developments in memory packaging.
10. Good program management skills.