Hybrid Photonic Packaging & Integration Engineer | Austin

ORCA Computing Ltd; Austin (TX); Hybrid; USD 110.000 - 180.000; Vollzeit

Zusammenfassung

ORCA Computing Ltd in Austin, TX, seeks a Photonic Integration Engineer to merge hands-on photonic component design with packaging strategy ownership. You will design ultra-low-loss components and PIC layouts, own packaging specifications, and manage fiber attach, wire bonding, and RF/driver integration to deliver packaged devices to spec.

You will collaborate with vendors from development to volume production, while maintaining high fiber-PIC coupling performance and documenting processes for

Qualifikationen

• Significant industry experience in photonic or optoelectronic device packaging, including fiber attach.
• Working knowledge of thermal management and RF/driver integration considerations for packaged photonic devices.
• Familiarity with photonic component design and simulation tools such as Lumerical MODE and FDTD.
• Familiarity with PIC fabrication processes and constraints.

Aufgaben

• Own packaging strategy and specifications, including fiber attach, wire bonding, and RF/driver integration.
• Manage relationships and specifications with external vendors from development to volume production.
• Maintain state of the art fiber-PIC coupling performance from the lab to packaged deployed devices.
• Contribute to the design and optimization of ultra-low-loss passive photonic components and electro-optic (EO) modulators.
• Develop and refine scalable, repeatable packaging processes.
• Analyze characterization data and iterate both device- and package-level performance.
• Maintain thorough documentation.

Kenntnisse

Photonic packaging

Thermal management

RF/driver integration

Lumerical MODE

Lumerical FDTD

PIC fabrication processes

Lumerical MODE

Lumerical FDTD

Ausbildung

Master’s or PhD in Photonics/Physics/Electrical Engineering

Tools

Lumerical MODE

Lumerical FDTD

Jobbeschreibung

ORCA Computing Ltd in Austin, TX, seeks a Photonic Integration Engineer to merge hands-on photonic component design with packaging strategy ownership. You will design ultra-low-loss components and PIC layouts, own packaging specifications, and manage fiber attach, wire bonding, and RF/driver integration to deliver packaged devices to spec.

You will collaborate with vendors from development to volume production, while maintaining high fiber-PIC coupling performance and documenting processes for