Hybrid Mechanical & Thermal Engineering Program Manager

Hewlett Packard Enterprise; Spring (TX); Hybrid; USD 72,000 - 164,000; Full time

Job summary

Hewlett Packard Enterprise invites applications for an individual contributor program manager within the HPC & AI hardware team. The role collaborates with engineers and program teams to define responsibilities and drive a high-quality time-to-market product.

You will manage BOMs and component specs for mechanical and thermal parts, plan with ODMs or vendors, and maintain expense forecasts. The position emphasizes cross-functional coordination and process improvement.

Qualifications

• Bachelor's degree in Business Management, Engineering, or equivalent.
• Typically 2-4 years experience.
• Strong written and verbal communication.
• Knowledge of project and program methodologies and budgeting.
• Ability to coordinate cross-functional teams and schedules.

Responsibilities

• Coordinates multiple projects within a program involving one or more functions driving the engineering development and implementation process for products or service offerings.
• Develops portions of support requirements for assigned project, including budgets, and resource allocation plans.
• Coordinates the activities of associated project teams; tracks progress against established plans, reports results, and makes recommendations for alterations or updates to program manager.
• Develops program communications, including creation of status reports and summaries, tracking escalations and resolutions of issues, coordinating stakeholder meetings and updates, and updating project and program plans.
• Leads resources across multiple projects.

Skills

Communication skills

Project planning tools

Analytical thinking

Organizational understanding

Program management knowledge

Manufacturing planning communication

Education

Bachelor's degree in Business Management, Engineering, or equivalent

Job description

Hewlett Packard Enterprise invites applications for an individual contributor program manager within the HPC & AI hardware team. The role collaborates with engineers and program teams to define responsibilities and drive a high-quality time-to-market product.

You will manage BOMs and component specs for mechanical and thermal parts, plan with ODMs or vendors, and maintain expense forecasts. The position emphasizes cross-functional coordination and process improvement.