HRER2026/393 Engineer for Advanced packaging of GaN-based HEMTs

UNIVERSIDAD POLITECNICA DE MADRID; Spain (TX); On-site; USD 36,000 - 59,000; Full time

Benefits offered by this job

Health and social benefits

Joint program with INDRA

Job summary

The Universidad Politécnica de Madrid invites applications for a research engineer to design, fabricate and characterize packaging architectures for SiP integration of GaN-based HEMTs. The role emphasizes developing packaging approaches using wirebonding and embedded chip techniques for high-frequency, high-power operation.

Responsibilities include thermal dissipation and RF signal integrity characterization via optical spectroscopy (Raman, IR) and RF measurements, with collaboration within the

Qualifications

• Bachelor Degree or equivalent in the listed fields.
• Proficiency in English.
• Goal-oriented mindset, creativity, teamwork & communication skills.
• Previous research experience, especially in cleanroom processing and electrical/optical characterization.

Responsibilities

• Design, fabrication and characterization of packaging architectures for SiP integration of GaN-based HEMTs.
• Study and development of packaging architectures (wirebonding and embedded chip) for high frequency/high power operation.
• Characterization of thermal dissipation and RF signal integrity using optical spectroscopy (Raman, IR) and RF measurements.

Skills

MS Office

LaTeX

Adobe Illustrator

AutoCAD

Python

C

LabVIEW

Mathematica

Matlab

Origin

COMSOL

Education

Electronic/Telecommunication/Materials Engineering

Physics

Tools

None

Job description

Organisation/Company UNIVERSIDAD POLITECNICA DE MADRID Department HRS4R Research Field Engineering » Electronic engineering Researcher Profile First Stage Researcher (R1) Positions Bachelor Positions Application Deadline 8 Oct 2026 - 23:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Hours Per Week 37,5 Offer Starting Date 28 Sep 2026 Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No

Offer Description

Design, fabrication and characterization of packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs:

• Study and development of various packaging architectures (wirebonding and embedded chip) for high frequency and high power operation
• Characterization of thermal dissipation and RF signal integrity in standalone and packaged devices by optical spectroscopy (Raman, IR) and RF measurements

Requirements

Research Field Engineering Education Level Bachelor Degree or equivalent

Research Field Physics Education Level Bachelor Degree or equivalent

Skills/Qualifications

• MS Office, Latex, Adobe Illustrator, AutoCAD
• Previous experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valued

Specific Requirements

• Candidates must hold a Bachelor Degree in Electronic/Telecommunication/Materials Engineering or Physics
• Proficiency in English
• Goal-oriented mindset, creativity, teamwork & communication skills
• Previous research experience will be highly valued, specially that related to cleanroom processing and electrical and optical characterization

Languages ENGLISH Level Good

Research Field Engineering » Electronic engineeringEngineering » Materials engineeringTechnology » Nanotechnology Years of Research Experience 1 - 4

Additional Information

• The hired engineer will work in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project “Chair UPM-INDRA in Microelectronics”.
• Health and social benefits according to Spanish law.

*The contracted researcher will participate in a joint program with INDRA, an international Spanish-based company, within the project “Chair UPM-INDRA in microelectronics”.

TSI-069100-2023-0016

Work Location(s)

Number of offers available 1 Company/Institute Instituto de Sistemas Optoelectrónicos y Microtecnología (ISOM) & Centro de Materiales y Dispositivos Avanzados para Tecnologías de Información y Comunicaciones (CEMDATIC) Country Spain State/Province MADRID City MADRID Postal Code 28040 Street Avenida Complutense, 30 Geofield