High Speed EIC Design Engineer

PR Photonics AI; Princeton (NJ); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Stock options

Performance bonuses

Career growth opportunities

Equity participation

Job summary

PR Photonics in New Jersey is seeking an experienced electrical engineer to design high-speed analog and mixed-signal ICs for silicon-photonics optical transceivers and CPO engines. You will develop drivers for modulators, design receiver front ends, and ensure high-speed performance across 100–200+ Gb/s lanes.

The role requires deep transistor-level design expertise, experience with Cadence tools, and collaboration with photonics, packaging, and test teams.

Qualifications

• PhD or MS in Electrical Engineering, Microelectronics, or related field.
• Strong background in high-speed analog, RF, or mixed-signal IC design.
• Experience with CMOS, SOI, or SiGe BiCMOS technologies.
• Understanding of transmission lines, impedance matching, and signal integrity.
• Experience with IC design tools Cadence Virtuoso and Spectre for design and verification.
• Ability to collaborate with photonics, packaging, and test engineers.

Responsibilities

• Design high-speed analog and mixed-signal ICs for silicon-photonics transceivers.
• Develop high-speed modulator drivers for silicon-photonic modulators.
• Design receiver front ends including TIA and limiting amplifier.
• Support NRZ and PAM4 signaling, 100–200+ Gb/s lanes.
• Perform schematic design, layout supervision, extraction, and post-layout verification.
• Collaborate with packaging engineers on EIC/PIC architectures.
• Document designs and test results.

Skills

High-speed analog design

RF design

Mixed-signal IC design

Transistor-level design

Signal integrity analysis

Team collaboration

Education

PhD or MS in Electrical Engineering or related field

Tools

Cadence Virtuoso

Spectre

Parasitic extraction tools

Post-layout verification tools

Job description

Company Description

PR Photonics develops advanced silicon-photonics technologies for next-generation AI and high-performance computing infrastructure. Our work focuses on high-bandwidth, low-power optical interconnects and co-packaged optical (CPO) engines integrating silicon photonic devices with advanced electronic integrated circuits.

Responsibilities

• Design high-speed analog and mixed-signal ICs for silicon-photonics optical transceivers and CPO optical engines.
• Develop high-speed modulator drivers for microring resonator (MRR) and other silicon-photonic modulators.
• Design receiver front ends including TIA, limiting amplifier, and related high-speed analog circuitry.
• Develop circuits supporting NRZ and PAM4 signaling, targeting 100–200+ Gb/s electrical/optical lanes.
• Design low-power bias, control, monitoring, DAC/ADC interface, and calibration circuits for photonic devices.
• Develop electronics for wavelength tuning, stabilization, and control.
• Perform EIC/PIC co-design to optimize bandwidth, power consumption, signal integrity, noise, and overall link performance.
• Model electrical parasitics associated with EIC-to-PIC interconnects, including wire bonds, micro-bumps, interposers, and advanced packaging.
• Perform schematic design, simulation, layout supervision, extraction, and post-layout verification.
• Conduct high-speed signal-integrity and power-integrity analysis.
• Support IC tapeout, bring-up, characterization, debugging, and performance optimization.
• Work with silicon-photonics designers to define electrical interfaces and optimize the photonic devices and electronics as a combined system.
• Collaborate with packaging engineers on tightly integrated EIC/PIC architectures for optical engines.
• Develop test methods and analyze measured high-speed electrical and optical data.
• Document designs, simulation results, design reviews, and silicon characterization.

Qualifications Required

• PhD or M.S. in Electrical Engineering, Microelectronics, Integrated Circuits, or a closely related field.
• Strong background in high-speed analog, RF, or mixed-signal IC design.
• Experience designing circuits in advanced CMOS, SOI, or SiGe BiCMOS technologies.
• Strong understanding of transistor-level analog/RF design and high-frequency circuit behavior.
• Experience with high-speed circuit simulation, layout, parasitic extraction, and post-layout verification.
• Understanding of transmission lines, impedance matching, signal integrity, jitter, noise, and high-speed I/O.
• Experience with industry-standard IC design tools such as Cadence Virtuoso, Spectre, and related verification/extraction tools.
• Ability to work closely with photonics, packaging, and test engineers in a multidisciplinary development environment.

Preferred

• Direct experience with silicon-photonics EIC/PIC co-design.
• Experience designing drivers for Mach-Zehnder and/or MRR modulators.
• Experience designing high-speed TIAs and optical receiver front ends.
• Experience with 100G/200G-per-lane NRZ or PAM4 architectures.
• Experience with low-power optical interconnects, CPO, or optical I/O.
• Familiarity with microring resonance control, wavelength locking, thermal tuning, and feedback control.
• Experience with SerDes, CDR, equalization, FFE/DFE, or clocking circuits.
• Experience with advanced packaging, 2.5D/3D integration, flip‑chip, micro‑bumps, or EIC/PIC co‑packaging.
• Hands‑on experience characterizing high-speed ICs using oscilloscopes, VNAs, BERTs, probe stations, and optical test equipment.
• Experience taking high-speed analog or mixed-signal ICs from architecture through tapeout and silicon validation.

Ideal Candidate

The ideal candidate combines strong transistor-level high-speed IC design expertise with an understanding of optical communication systems. You should be comfortable treating the EIC, photonic IC, package, and optical link as a single system rather than independently optimized components.

This position offers the opportunity to develop extremely low-power, high-bandwidth electronic-photonic interfaces for next-generation AI computing and data-center optical connectivity.

Compensation

In addition, eligible employees may receive: stock option grants, performance-based bonuses, comprehensive benefits package, and career growth opportunities

Why Join PR Photonics?

• Help build breakthrough technologies for AI infrastructure
• Direct impact on product and technology direction
• Meaningful equity participation
• Collaborative startup environment
• Opportunity to work alongside world‑class photonics engineers\

Contact:[e-mail]

PR Photonics is an Equal Opportunity Employer.