Product Yield Enhancement Engineer, HBM

Micron Technology, Inc; Boise (ID); On-site; USD 80,000 - 100,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid family leave

Paid time off and holidays

Job summary

Micron Technology, Inc is seeking a Product Yield Enhancement Engineer specializing in High Bandwidth Memory (HBM) for their Boise, Idaho location. This role involves conducting failure analysis of next-gen HBM devices and presenting findings to multiple teams.

The ideal candidate will have a Bachelor's in Electrical Engineering or a related field, with 2-5 years of experience in semiconductor yield analysis, fault isolation, and relevant scripting skills.

Micron offers competitive medical, dental, and vision plans, along with other robust benefits to support employee wellbeing.

Qualifications

• 2 to 5 years of semiconductor experience in Yield and fault analysis.
• Demonstrated knowledge of semiconductor device physics including VLSI design.
• Experience with UNIX/Linux scripting (Tcl, Bash, SHELL, etc).

Responsibilities

• Perform Electrical Failure Analysis using various isolation techniques.
• Generate organized and timely failure analysis reports.
• Understand various PFA and de-processing techniques for failures.

Skills

Electrical Failure Analysis

Fault Isolation

CMOS/FinFET Process Fabrication

Scripting in UNIX/Linux

Education

Bachelor's degree in Electrical Engineering

Tools

Computer-aided layout and schematic software

Job description

Req ID: JR93078 – Product Yield Enhancement Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Product Yield Enhancement (PYE) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation HBM devices from design to mass production!

We focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market. Our primary areas of responsibility apply fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step. You will maintain an in-depth knowledge of HBM technology, testing methodology, assembly technology and fabrication process. Additionally, you will be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams!

Responsibilities

• Perform Electrical Failure Analysis and Fault Isolation using methods such as emission, laser techniques, and EOTPR.
• Characterize or model backend test, internal qualification, and RMA fail signatures.
• Understand various PFA and de-processing techniques for failures.
• Maintain an in-depth understanding of CMOS/FinFET process fabrication levels, steps, and methodologies.
• Generate organized and timely failure analysis reports with clearly communicated causes and effects.
• Must be available to work either shift, including swing or night shifts, based on business needs.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, or Chemistry, or an equivalent amount of relevant experience.
• 2 to 5 years of demonstrated semiconductor experience in Yield and fault analysis.
• Computer-aided layout and schematic experience.
• Demonstrated knowledge of semiconductor device physics including VLSI design.
• Scripting within a UNIX/Linux environment (Tcl, Bash, SHELL, etc).

Preferred Qualifications

• Master's degree in Electrical Engineering or Material Science.
• Experience performing Fault Isolation and Failure Analysis.
• Extensive understanding of Physical and logical design.
• Understanding of Package Assembly and Fabrication Process.
• Experience in reliability and quality analysis.

Benefits

Micron benefits include medical, dental, vision plans, income protection, paid family leave, paid time off and holidays, and robust benefit programs to support your wellbeing and professional growth.

Equal Employment Opportunity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.