HBM Yield & Failure Analysis Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off and holidays

Paid family leave

Job summary

1000 Micron Technology, Inc. is seeking a Product Yield Enhancement High Bandwidth Memory Electrical Failure Analysis Engineer to join our team in Boise, Idaho. You will work on next-gen HBM devices, focusing on failure analysis and reliability enhancement.

Ideal candidates will possess a Bachelor’s degree in Engineering or equivalent experience, along with 2-5 years in semiconductor yield analysis. Our competitive benefits include healthcare plans, paid time-off, and leave for family events.

Qualifications

• Bachelor’s degree or equivalent experience in Electrical Engineering.
• 2 to 5 years of demonstrated experience in semiconductor yield and fault analysis.
• Computer-aided layout and schematic experience required.

Responsibilities

• Perform Electrical Failure Analysis using emission and laser techniques.
• Generate organized and timely failure analysis reports.
• Characterize backend test and internal qualification fail signatures.

Skills

Electrical Failure Analysis

Fault Isolation

Semiconductor experience

Scripting in UNIX/Linux

Electrical Engineering

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics or Chemistry

Master’s degree in Electrical Engineering or Material Science

Job description

1000 Micron Technology, Inc. is seeking a Product Yield Enhancement High Bandwidth Memory Electrical Failure Analysis Engineer to join our team in Boise, Idaho. You will work on next-gen HBM devices, focusing on failure analysis and reliability enhancement.

Ideal candidates will possess a Bachelor’s degree in Engineering or equivalent experience, along with 2-5 years in semiconductor yield analysis. Our competitive benefits include healthcare plans, paid time-off, and leave for family events.