Hardware Test Intern: Build & Validate Flight Systems

Zipline

South San Francisco (CA)

On-site

USD 34,440,000 - 55,104,000

Full time

14 days+
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Benefits offered by this job

In-person internship
Spring 2027 program

Job summary

Zipline is seeking a Hardware Test Intern to join the Hardware Test Team. You will help develop test assets, validate electronics and mechanical assemblies, and create automation scripts coordinating sensors, actuators, and instrumentation with safety in mind.

You will own test assets end‑to‑end, from concept through data collection, analysis, and engineering-relevant recommendations. This internship is in-person at our South San Francisco or Dallas office for Spring 2027.

Qualifications

  • Ability to interpret datasheets and write basic drivers for new components.
  • Understanding of fundamental electrical and/or mechanical engineering principles.
  • Experience working with common electrical test equipment (multimeters, oscilloscopes, power supplies, etc.)

Responsibilities

  • Collaborate with cross‑functional teams to define tester requirements and verify designs.
  • Validate assembly of components from PCBs to electromechanical systems.
  • Streamline testing, data collection, analysis, and reporting.
  • Develop deep understanding of test assets and their operating conditions.
  • Own a test asset end‑to‑end from planning to analysis and recommendations.

Skills

Datasheet interpretation
Driver development
Embedded C
Python scripting
Hardware interfacing

Tools

Multimeters
Oscilloscopes
Power supplies

Job description

Zipline is seeking a Hardware Test Intern to join the Hardware Test Team. You will help develop test assets, validate electronics and mechanical assemblies, and create automation scripts coordinating sensors, actuators, and instrumentation with safety in mind.

You will own test assets end‑to‑end, from concept through data collection, analysis, and engineering-relevant recommendations. This internship is in-person at our South San Francisco or Dallas office for Spring 2027.

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