Hardware Engineering Technical Leader

Jobtailor; Massachusetts; On-site; USD 120,000 - 190,000; Full time

Job summary

Jobtailor is seeking a seasoned engineer to lead optical transceiver assembly process development and drive wafer-level packaging initiatives in a high-volume manufacturing environment.

The role requires deep expertise in back-end wafer processing, materials characterization, and cross-functional leadership to optimize manufacturing processes for cost-efficiency and reliability.

Qualifications

• Bachelor's degree in Physics, Mechanical Engineering, Materials Science, or a related field with 12+ years of experience, or Masters + 8 years of related experience, or PhD + 5 years of related experience.
• 8+ years of experience in back-end wafer processing
• expertise in materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes
• experience managing overseas contract manufacturers
• leading cross-functional teams to resolve manufacturing issues
• delivering consistent results in high-volume production environments

Responsibilities

• Lead technical ownership of optical transceiver assembly process development
• Develop high-volume, highly automated, and cost-effective manufacturing processes
• Drive the development and optimization of 2D/2.5D/3D wafer-level packaging processes
• Design and implement Design of Experiments (DOE) to optimize process capability
• Serve as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment
• Partner cross-functionally with design, test, reliability, and manufacturing teams to improve product manufacturability

Skills

Cross-Functional Team Leadership

Problem Solving

High-Volume Production

Design Of Experiments (DOE)

Manufacturing Process Optimization

Education

Bachelor's degree in Physics, Mechanical Engineering, Materials Science, or related field

Master's degree + 8 years experience

PhD + 5 years experience

Tools

Wafer Processing Equipment

Mechanical Assembly Automation Equipment

Materials Characterization Equipment

Job description

• Lead technical ownership of optical transceiver assembly process development
• Develop high-volume, highly automated, and cost-effective manufacturing processes
• Drive the development and optimization of 2D/2.5D/3D wafer-level packaging processes
• Design and implement Design of Experiments (DOE) to optimize process capability
• Serve as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment
• Partner cross-functionally with design, test, reliability, and manufacturing teams to improve product manufacturability

Requirements

• Bachelor's degree in Physics, Mechanical Engineering, Materials Science, or a related field with 12+ years of experience, or Masters + 8 years of related experience, or PhD + 5 years of related experience
• 8+ years of experience in back-end wafer processing
• expertise in materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes
• experience managing overseas contract manufacturers
• leading cross-functional teams to resolve manufacturing issues
• delivering consistent results in high-volume production environments

Core Competencies

Demonstrates expertise in optical transceiver assembly process development, wafer-level packaging, and mechanical assembly automation. Proven ability to lead cross-functional teams and optimize manufacturing processes in high-volume production environments.

Highest-signal resume keywords

• Optical Transceiver Assembly Process Development
• Wafer-Level Packaging
• Design Of Experiments (DOE)
• Materials Characterization
• High-Volume Production

ATS Optimization Keywords

Hard Skills

• Back-End Wafer Processing
• Failure Analysis
• IC Packaging Materials
• Semiconductor Packaging Manufacturing
• Process Optimization

Soft Skills

• Cross-Functional Team Leadership
• Problem Solving

Industry Keywords

• Manufacturing Processes
• Contract Manufacturing
• Product Manufacturability

Tools & Technologies

• Mechanical Assembly Automation Equipment