Silicon Photonics Packaging Technical Leader

Jobtailor; California (MO); On-site; USD 140,000 - 190,000; Full time

Job summary

Cisco is seeking a senior packaging engineer to develop and qualify advanced packaging solutions for next-generation optical transceiver products. You will act as the main technical interface for the Client Optics Group with top OSAT partners and lead test-vehicle design to validate packaging processes.

You will conduct rigorous design reviews, ensure signal/power integrity, and drive cross-functional leadership to mitigate risks and maintain reliability across the supply chain.

Qualifications

• Must have advanced packaging experience in photonics or semiconductor packaging.
• Experience with 2.5D/3D integration, TSV, flip-chip, stacking and wafer-level packaging.
• Proficient with substrate design, design for manufacturability and reliability practices.

Responsibilities

• Develop and qualify advanced packaging solutions for next-generation optical transceivers.
• Lead the design and layout of test vehicles to validate packaging processes.
• Serve as the primary technical interface for the Client Optics Group with OSAT partners.
• Conduct rigorous design reviews for complex substrates, ensuring SI/PI and manufacturability.
• Provide cross-functional technical leadership to mitigate risks and ensure quality.
• Influence package architecture and advise on DfM, DfR across the supply chain.
• Engage in substrate design, materials reviews, and stay current on packaging tech.
• Present findings and recommendations to cross-functional teams and stakeholders.

Skills

Technical Communication

Collaboration

Problem Solving

Leadership

Education

Master's Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or related field

PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or related field

Tools

Cadence

Klayout

Ansys

Job description

• responsible for the development and qualification of advanced packaging solutions for Cisco’s next generation optical transceiver products
• serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT)
• lead the design and layout of test vehicles to validate packaging processes
• conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities
• cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain
• work collaboratively with other internal teams to influence package architecture and provide expert guidance on DfM, DfR
• engage deeply in substrate design, materials selection, and reviews
• present technical findings and recommendations to cross-functional teams and stakeholders
• stay informed on emerging packaging technologies and industry trends

Requirements

• Masters Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 8+ years of experience in Photonics or Semiconductor Packaging Industry or a PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 3+ years of experience in Photonics or Semiconductor Packaging Industry
• Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods
• Prior experience of package design & architecture, including substrate design and chip fabrication
• Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity
• Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools)

Core Competencies

Demonstrates expertise in advanced packaging solutions for optical transceivers, with a strong focus on Silicon Photonic package technology development and substrate design. Proven ability to lead cross-functional teams, conduct rigorous design reviews, and influence package architecture while ensuring quality and reliability standards.

Highest-signal resume keywords

• Advanced Silicon Photonic Package Technology Development
• Substrate Design & Architecture
• Design & Simulation Software (Cadence, Klayout, Ansys)
• Cross-Functional Technical Leadership
• Risk Mitigation & Quality Assurance

ATS Optimization Keywords

Hard Skills

• Silicon Photonic Package Technology
• 2.5D/3D Integration
• TSV
• Flip-Chip
• Stacking
• Hybrid Integration
• Wafer-Level Packaging
• Package Technology Qualification Methods
• Advanced Substrate Manufacturing Processes
• Signal/Power Integrity

Soft Skills

• Technical Communication
• Collaboration
• Problem Solving
• Leadership

Industry Keywords

• Photonics
• Semiconductor Packaging
• Design for Manufacturing (DfM)
• Design for Reliability (DfR)

Tools & Technologies

• Cadence
• Klayout
• Ansys