Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm

Boxborough (MA)

On-site

USD 28,000 - 41,000

Full time

24 hours ago
Be an early applicant
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Qualcomm Technologies, Inc. invites hardware engineering interns to join our summer program in Massachusetts.

You will contribute to multi-disciplinary teams across GPU, CPU, and SoC tracks, applying your electrical or computer engineering knowledge to real-world design challenges. As an intern, you will gain hands-on exposure to architecture, RTL, verification, CAD, and debugging techniques within a leading AI and connectivity focused company.

Qualifications

  • Pursuing or completed degree in Electrical or Computer Engineering.
  • Strong fundamentals in digital design and HDL concepts.
  • Proficiency in programming languages listed (C, Python, C++, Verilog, SystemVerilog).

Responsibilities

  • Support GPU/CPU/SoC design tracks with hands-on engineering tasks.
  • Assist in pre-silicon verification and CAD workflows.
  • Collaborate with multi-disciplinary teams across architecture, validation and design.

Skills

C
Perl
Verilog
SystemVerilog
C++
Python

Education

Electrical or Computer Engineering degree

Job description

  • GPU Engineering
  • CPU Engineering
  • SoC Systems Engineering
Company

Qualcomm Technologies, Inc.

Job Area

Interns Group, Interns Group > Interim Engineering Intern - HW

About Qualcomm

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology. Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2027 summer intern class!

Maximize Your Opportunities

Our internship hiring model routes candidates from this application into multiple project specific roles. Your 'Profile Visibility' choice will guide how we manage your data across our systems. To be considered for the full breadth of internship opportunities, select the option to use your profile data for 'Any Roles Globally'. If you choose to limit your data to 'Only The Role I'm Applying For', it will restrict the opportunity for you to be considered across matching internship opportunities. You can update your profile visibility preferences at any time through the Candidate Home Portal.

Steps
  • Log Into Your Eightfold Candidate Home Account
  • Hover Over The \"Profile\" Dropdown
  • Open Settings
  • Edit \"Profile Visibility\"
Role Overview

As a Qualcomm Hardware Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of the following Qualcomm multi-disciplinary teams: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.

This Internship Supports Multiple Technical Tracks, Including
  • GPU Engineering
  • CPU Engineering
  • Digital Design / DV
  • SoC Systems Engineering
Track 1: GPU Engineering
  • Engineering design and development in MSM SOC and chipset architecture
  • ASIC implementation of image processing camera IP
  • GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
  • Graphics power analysis & optimization (Vulkan)
  • Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
  • Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python
Track 2: CPU Engineering
  • Validation of CPU and SOC-level micro-architecture concepts
  • Development of test and coverage plans, verification methodology, and scalable environments
  • Execution of verification plans including regression,
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm • Santa Clara (CA)

On-site
USD 33,000 - 39,000
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm • Austin (TX)

On-site
USD 27,000 - 38,000
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Relocation and housing for internship
Multimedia Engineering Internship – Summer 2027
Multimedia Engineering Internship – Summer 2027

Qualcomm • Santa Clara (CA)

On-site
USD 23,000 - 135,000
Relocation covered
Housing provided
Competitive hourly pay
+1
Multimedia Engineering Internship – Summer 2027
Multimedia Engineering Internship – Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Competitive hourly pay
Mechanical Engineering Internship – Summer 2027
Mechanical Engineering Internship – Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 81,000 - 135,000
Relocation coverage
Furnished housing for internship
Mechanical Engineering Internship – Summer 2027
Mechanical Engineering Internship – Summer 2027

Qualcomm • Santa Clara (CA)

On-site
USD 23,000 - 135,000
Relocation covered
Furnished housing
Software Engineering Internship - Summer 2027
Software Engineering Internship - Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 55,000 - 110,000
Mechanical Engineering Internship – Summer 2027
Mechanical Engineering Internship – Summer 2027

Qualcomm • Austin (TX)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing accommodations
Embedded Engineering Internship - Summer 2027
Embedded Engineering Internship - Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 48,712,000 - 280,810,000