Graduate Field Applications Engineer — Embedded & Edge AI

NXP Semiconductors NV; San Jose (CA); On-site; USD 60,000 - 80,000; Full time

Job summary

NXP Semiconductors NV in the United States invites ambitious new graduates to join the Technical Sales & Applications Program (TSAP). This early-career path blends structured learning with hands-on experience to become a Field Application Engineer for Industrial, IoT, and Automotive markets.

Participants rotate through integrated and on-the-job training, transition to a permanent FAE role in the Americas, and gain experience solving real customer problems while building deep product knowledge

Qualifications

• Bachelor's or Master's in Electrical/Computer Engineering, Mechatronics, or related field.
• Graduating in past 24 months or upcoming graduate.
• Minimum GPA 3.0 or higher.
• Strong electronics and embedded MCU/MPU software for robotics incl real-time control, motor control, sensor integration, edge AI, and Linux- or RTOS-based systems.
• Foundational understanding of analog/digital circuits, embedded systems, MCUs/MPUs, semiconductor apps, and software in C/C++/Python.
• Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards, and lab tools.
• Strong problem-solving and analytical skills; able to learn quickly.
• Good written and verbal communication; able to explain tech to different audiences.
• Ability to collaborate cross-functional and customer-focused.
• Self-motivated, curious, eager to develop tech and business acumen.
• Experience presenting technical work via class projects, internships, research, competitions, or student organizations.
• Demonstrated leadership, teamwork, or campus involvement.
• Internship, co-op, or project experience in applications engineering, design engineering, embedded software, technical sales, or customer support.
• Willingness to relocate to Austin and travel within North America.

Responsibilities

• Provide technical leadership to sales teams and customers covering NXP portfolio. Ex – MCU/MPU selection, bring-up, and software stack integration.
• Lead PoC development, product evaluations, debug activities, integration efforts, lab validation and basic system-level troubleshooting using oscilloscopes, current/voltage probes, power analyzers, and software debug/trace tools.
• Design support through schematic and PCB reviews
• Prepare and deliver technical presentations, demonstrations and training materials with guidance from senior engineers
• Collaborate with sales, marketing, product management and engineering teams to communicate customer needs and support business opportunities
• Drive enablement initiatives by communicating customer feedback, identifying gaps in collateral, and partnering with product lines to improve tools, software, and documentation
• Represent NXP technology at customer meetings, workshops, partner and industry activities

Skills

C/C++

Embedded systems

Problem solving

Communication

Education

Bachelor's or Master's in Electrical/Computer Engineering, Mechatronics, or related field

Tools

IDEs

Evaluation boards

Lab equipment

UART/SPI/I2C/CAN

Job description

NXP Semiconductors NV in the United States invites ambitious new graduates to join the Technical Sales & Applications Program (TSAP). This early-career path blends structured learning with hands-on experience to become a Field Application Engineer for Industrial, IoT, and Automotive markets.

Participants rotate through integrated and on-the-job training, transition to a permanent FAE role in the Americas, and gain experience solving real customer problems while building deep product knowledge