Field Applications Engineer — Early-Career Tech Sales

NXP Semiconductors; Novi (MI); On-site; USD 65,000 - 90,000; Full time

Job summary

NXP is seeking graduates for its Technical Sales & Applications Program (TSAP) in North America, focusing on Industrial, IoT, and Automotive markets. The program prepares participants for long‑term careers as Field Application Engineers by blending structured learning with hands‑on experience.

Participants transition into a permanent FAE role within the Americas Sales organization, with relocation to Austin and travel within North America as needed.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
• Graduate in past 24 months or upcoming graduate
• Minimum GPA of 3.0 or higher
• Passion for electronics, embedded MCU/MPU software for robotics applications, including real‑time control, motor control, sensor integration, edge AI, and Linux‑or RTOS‑based system development
• Foundational understanding of analog and digital circuits, embedded systems, microcontrollers, processors, semiconductor applications, and software development skills in C, C++, Python, or similar languages
• Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards, and common lab tools
• Strong problem‑solving and analytical skills, with the ability to learn new technologies quickly
• Good written and verbal communication skills, with the confidence to explain technical concepts to different audiences
• Ability to work effectively in a collaborative, cross‑functional, and customer‑focused environment
• Self‑motivated, curious, and eager to develop both technical expertise and business acumen
• Experience presenting technical work through class projects, internships, research, competitions, or student organizations
• Demonstrated leadership, teamwork, or campus involvement through engineering teams, competitions, or technical societies
• Internship, co‑op, or project experience in applications engineering, design engineering, embedded software, technical sales, or customer support

Responsibilities

• Provide technical leadership to sales teams and customers covering NXP portfolio. Ex – MCU/MPU selection, bring‑up, and software stack integration.
• Lead proof of concept development, product evaluations, debug activities, integration efforts, lab validation and basic system‑level troubleshooting using oscilloscopes, current/voltage probes, power analyzers, and software debug/trace tools.
• Design support through schematic and PCB reviews
• Prepare and deliver technical presentations, demonstrations and training materials with guidance from senior engineers
• Collaborate with sales, marketing, product management and engineering teams to communicate customer needs and support business opportunities
• Drive enablement initiatives by communicating customer feedback, identifying gaps in collateral, and partnering with product lines to improve tools, software, and documentation
• Represent NXP technology at customer meetings, workshops, partner and industry activities

Skills

Embedded systems

C/C++

Python

Debugging & test

Technical communication

Team collaboration

Relocation to Austin

Problem solving

Customer-focused

Education

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field

Tools

Oscilloscopes

Power analyzers

IDE/SDKs

Job description

NXP is seeking graduates for its Technical Sales & Applications Program (TSAP) in North America, focusing on Industrial, IoT, and Automotive markets. The program prepares participants for long‑term careers as Field Application Engineers by blending structured learning with hands‑on experience.

Participants transition into a permanent FAE role within the Americas Sales organization, with relocation to Austin and travel within North America as needed.