GaN Process Integration Engineer (SM1)

Texas Instruments; Sherman (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Texas Instruments in Sherman, TX is seeking a GaN Process Integration Engineer to advance device integration for GaN technology nodes. You will collaborate with ATD, Process, Test, Product, Quality and Manufacturing teams to drive improvements.

The role requires strong understanding of semiconductor device physics, data analysis and design of experiments, with cross-functional leadership to transfer, qualify and manufacture GaN devices.

Responsibilities

• Drive process and device improvements for GaN technology nodes.
• Coordinate with ATD, Process, Test, Product, Quality and Manufacturing groups.
• Lead cross-functional teams to transfer, qualify and manufacture GaN devices.

Job description

Job Description

Texas Instruments is looking for a skilled GaN Process Integration (PI) Engineer, to join our team supporting SMFAB. This engineer will be an invaluable part of the team and in this role, you will drive the integration and development for existing and future GaN technology nodes, interfacing and communicating with ATD (Advanced Technology Development), Process engineering, Parametric Test engineering, Product development, Quality and Manufacturing groups across the organization. This position provides the opportunity to drive continual improvement at all levels.

The responsibilities of a GaN Process Integration Engineer in this role include:

• Utilize technical knowledge of semiconductor device physics to enable competitive technology through process and parametric improvements
• Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation
• Ownership of technology parametric performance, parametric Cpk improvements
• Parametric test dispositions including root cause determination for scrap or outliers, definition and evaluations of experiments to improve processes
• Product flow creation/review
• Short flow and test chip development
• Partnering with the RET team to validate OPC and make improvements, as appropriate
• Cross functional team leadership to support the transfer, development, qualification, and manufacturing of GaN technology nodes
• Work with multiple process, integration, product, quality, reliability, packaging and test engineers to achieve goals
• Work closely with the product groups to identify and optimize the process performance to meet critical final device parameters to enable game changing products in the market

The person performing this role must be capable of planning effectively, driving schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.