Field Process Engineer - High Volume Manufacturing/Field Applications

Oxford Instruments; Houston (TX); Hybrid; USD 100,000 - 120,000; Full time

Job summary

Oxford Instruments is seeking a Field Process Engineer specializing in High Volume Manufacturing for advanced plasma processing systems. You will work closely with manufacturing environments to ensure optimal tool performance, customer acceptance, and yield improvement.

The ideal candidate will have a Bachelor's degree in a STEM field, plus 3–8 years of relevant experience, particularly with plasma etch or deposition tools. This role necessitates travel up to 50% and provides an opportunity to support cutting-edge technology in the semiconductor sector.

Qualifications

• 3–8+ years of experience in semiconductor manufacturing.
• Hands-on experience with plasma etch/deposition systems.
• Ability to work in a fast-paced environment.

Responsibilities

• Lead tool validation and customer acceptance activities.
• Optimize plasma processes to enhance yield and throughput.
• Develop process recipes and support daily fab operations.

Skills

Plasma etch/deposition tool expertise

PLC control circuit troubleshooting

Knowledge of vacuum systems

Strong analytical and problem-solving skills

Education

Bachelor’s degree in a STEM field

Tools

PLC systems

Job description

Field Process Engineer - High Volume Manufacturing / Field Applications

Location: Concord, MA, US
Texas (Houston or DFW)

Reports To: Field Process Service Manager
Travel: Up to 50% | FLSA: Exempt

Applicants must be authorized to work for any employer in the US. We are unable to sponsor employment visas at this time.

Position Summary
Oxford Instruments is seeking a Process Engineer – High Volume Manufacturing (HVM) / Field Applications to support advanced plasma processing systems across semiconductor manufacturing environments. This role blends field service expertise with process engineering ownership, supporting tool performance, customer acceptance, yield optimization, and uptime in 24/7 HVM operations. The ideal candidate has experience working with Lam Research, Applied Materials, or Tokyo Electron (TEL) and strong tool knowledge. The role requires hands‑on engagement with plasma etch/deposition systems, vacuum systems, chamber maintenance, wet cleans, contamination control, and process recovery in a fast‑paced manufacturing environment.

Key Responsibilities

• Lead tool validation, qualification, and customer acceptance activities
• Verify system performance against specifications
• Optimize plasma processes for yield and throughput
• Support production ramp into HVM
• Develop process recipes from existing starting points
• Support daily fab operations
• Monitor chamber and tool performance
• Analyze trends and implement fixes

Required Qualifications

• Bachelor’s degree in a STEM field
• 3–8+ years of experience
• Experience with plasma etch or deposition tools
• PLC control circuit troubleshooting skills
• Knowledge of vacuum and RF systems

Work Environment

• Cleanroom PPE required
• Physically active work setting
• Travel up to 50%

Compensation

In accordance with Massachusetts law, the expected salary for this full‑time, benefited position is between $100,000 and $120,000. The actual compensation will be determined based on relevant skills, experience, and other factors permitted by law.