Field Applications Engineer - Power Delivery

Powerlattice Technologies Inc.; Chandler (AZ); Hybrid; USD 150,000 - 225,000; Full time

Benefits offered by this job

Stock option grant

Health, dental, vision, and 401(k)

Job summary

Powerlattice Technologies Inc. is seeking a Field Applications Engineer to support customers adopting our chiplet-based PDN solution.

You will bridge internal design teams and tier-one customers with hands-on technical engagement across GPU/CPU SoCs in a fast-paced startup environment. This hybrid role requires 3 days on site in Chandler, AZ or San Jose, CA, with strong power integrity experience and the ability to translate customer feedback into product improvements.

Qualifications

• 5 years of experience in power integrity and/or signal integrity for high-performance SoCs.
• Experience with package-level power integrity and signal integrity, including motherboard, substrates, interposers, and advanced packaging (2.5D / 3D).
• Excellent written and verbal communication skills, with the ability to engage directly with customer engineering teams.

Responsibilities

• Enable customers to design GPU/CPU SoC power solution with Powerlattice's chiplet.
• Assist customer's PDN design optimization using Powerlattice's design kit.
• Gather customer feedback and translate insights into improvements for customer enablement and product development.
• Assist customers through the full adoption lifecycle, from early modeling through physical design and system bring-up.
• Maintain strict confidentiality and handle sensitive technical information with discretion.
• Act as a primary technical point of contact for tier-one customers.

Skills

Power integrity

Signal integrity

SoC design

Customer engagement

Debugging

Communication

Tools

Design kit

Electrical test equipment

Job description

Field Applications Engineer - Power Delivery

About Us

Powerlattice is a well-funded semiconductor startup backed by leading Silicon Valley venture capital firms. We are developing a groundbreaking chiplet solution for a fundamental shift in how high-performance chips are powered, paving the way for the next generation of AI and advanced computing. We are the first to offer a tiny device that can be integrated into a SoC package.

About the Role

We are seeking a field applications engineer to support customers adopting Powerlattice's chiplet-based power delivery network (PDN) solution. This role sits at the intersection of deep technical expertise and customer engagement, serving as a critical bridge between our internal design teams and tier-one customers.

The ideal candidate is highly organized, proactive, and articulate, with the technical credibility to partner directly with customer engineering teams working on the most advanced xPU SoCs in the industry. This role offers significant opportunity for impact, ownership, and growth, contributing directly to both customer product success and Powerlattice's commercial momentum.

This position is well suited for someone who thrives in a fast-paced startup environment, anticipates needs before they arise, and enjoys being a trusted technical advisor to customers and internal teams alike.

Key Responsibilities

• Enable customers to design GPU/CPU SoC power solution with Powerlattice's chiplet
• Assist customer's PDN design optimization using Powerlattice's design kit
• Gather customer feedback and translate insights into improvements for customer enablement and product development
• Assist customers through the full adoption lifecycle, from early modeling through physical design and system bring-up
• Maintain strict confidentiality and handle sensitive technical information with discretion
• Act as a primary technical point of contact for tier-one customers

Qualifications

This role is Hybrid requiring 3 days a week onsite at either our Chandler, AZ (Greater Phoenix) office or San Jose, CA.

• 5 years of experience in power integrity and/or signal integrity for high-performance SoCs
• Experience with package-level power integrity and signal integrity, including motherboard, substrates, interposers, and advanced packaging (2.5D / 3D)
• Strong debugging skills to reproduce and resolve technical issues
• Excellent written and verbal communication skills, with the ability to engage directly with customer engineering teams
• High level of professionalism, discretion, and sound technical judgment
• Comfortable working independently and proactively solving problems

Bonus Points

• Working experience at major processor or ASIC companies in the related technical area
• Proven experience as engineering or project lead in a related technical area
• Hands-on experience with electrical test methodologies and instrumentation for power or signal integrity
• Experience in advanced package technologies, e.g. CoWoS, 2.5D.5D

Compensation & Benefits

Anticipated annual base salary for Member of Technical Staff: $150,000 - $225,000

• Stock option grant
• Comprehensive benefits package including health, dental, vision, and 401(k)