Field Applications Engineer -

Electronic Careers; San Francisco (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Amphenol is seeking a Field Application Engineer for Power Interconnects in the San Francisco Bay Area. You will provide technical support across North America for power-to-board and power-to-rack connectors and liquid cooling used in AI servers, data centers, and HPC systems.

You will collaborate with hyperscale, OEMs, and rack integration customers, translating specifications into interconnect designs while driving new product development aligned with AI architectures.

Qualifications

• Bachelor’s degree in Electrical, Mechanical, or Mechatronic Engineering.
• 3–7 years in connector design, power electronics, or related hardware roles.
• Experience with AI data centers, rack power distribution, or cooling systems.
• Customer-facing or field engineering experience required.
• Familiar with industry standards or consortia (OCP, PCIe) a plus.
• Knowledge of AI compute racks, GPU servers, power delivery architectures (48V, busbars) desirable.

Responsibilities

• Support AI and data center customers in design, development, and integration of power connector solutions into rack, server, and board-level systems.
• Translate customer specifications into interconnect designs, collaborating with internal engineering and manufacturing teams.
• Provide technical leadership in power delivery standards and participate in relevant working groups (e.g., OCP, ODCC, or hyperscaler initiatives).
• Drive innovation in connector technologies for high-current, low-resistance, and high-reliability applications.
• Partner with sales and business development to provide technical insight during design-in and qualification phases.
• Conduct field validation, performance testing, and troubleshooting at customer sites or Amphenol labs.
• Act as the voice of the customer to inform future product roadmap and technology direction.
• Maintain up-to-date awareness of AI hardware trends, including rack density, power efficiency, and modular architecture developments.

Skills

Customer-facing

Field engineering

Interconnect design

Power electronics

AI data centers

Education

Bachelor's degree in Electrical, Mechanical, or Mechatronic Engineering

Master's degree preferred

Job description

Field Application Engineer - Power Interconnects

Bay Area- CA

The Field Application Engineer (FAE) - Power Interconnects will provide technical support and application expertise across North America for Amphenol’s power-to-board and power-to-rack connector solutions and liquid cooling used in AI server, data center, and high-performance computing (HPC) applications. This individual will be a key technical interface between customers, sales, and product development teams, ensuring interconnect technologies meet the evolving power distribution needs of next-generation AI architectures.

The role includes collaboration with hyperscale, OEM, and rack integration customers, as well as participation in industry initiatives related to high-density power delivery and AI system infrastructure standards. You will be expected to develop new business and drive new product development needs to meet the markets technology trends, by working internally with global Product Management, Business Development and Engineering.

Essential Duties & Responsibilities

• Support AI and data center customers in the design, development, and integration of power connector solutions into rack, server, and board-level systems.
• Translate customer specifications and requirements into interconnect designs, collaborating closely with internal engineering and manufacturing teams.
• Provide technical leadership in power delivery standards and participate in relevant working groups (e.g., OCP, ODCC, or hyperscaler-specific initiatives).
• Drive innovation in connector technologies for high-current, low-resistance, and high-reliability applications.
• Partner with sales and business development to provide technical insight during design-in and qualification phases.
• Conduct field validation, performance testing, and troubleshooting at customer sites or Amphenol labs.
• Act as the voice of the customer to inform future product roadmap and technology direction.
• Maintain up-to-date awareness of AI hardware trends, including rack density, power efficiency, and modular architecture developments.

Qualifications

Education & Experience Requirements

• Bachelor's degree in Electrical, Mechanical, or Mechatronic Engineering (Master's preferred).
• 3-7 years of experience in connector design, power electronics, or related hardware integration roles.
• Experience in AI data centers, rack power distribution, cooling systems, or server platform engineering strongly preferred.
• Customer-facing or field engineering experience required.
• Prior involvement with industry standards or consortiums (OCP, PCIe, or similar) a plus.
• Familiarity with AI compute racks, GPU servers, and power delivery architectures (e.g., 48V, blind-mate power, busbars) highly desirable.