Field Application Engineer - Power Interconnects

Amphenol Industrial Operations; San Francisco (CA); On-site; USD 135,000 - 210,000; Full time

Benefits offered by this job

HSA

FSA

401k with company matching

Job summary

Amphenol Industrial Operations in the Bay Area seeks a Field Application Engineer for power interconnects and AI data center applications. You will interface between customers, sales, and product teams to ensure robust interconnect solutions for rack, server, and board-level systems.

Ideal candidates have 3–7 years in power electronics, strong CAD skills, and experience with data center hardware. Travel domestically/internationally up to 50% is required as needed.

Qualifications

• Bachelors in Electrical, Mechanical, or Mechatronic Engineering (Master’s preferred).
• 3–7 years of experience in connector design, power electronics, or related hardware integration.
• Experience in AI data centers, rack power distribution, cooling systems, or server platform engineering preferred.
• Customer-facing or field engineering experience required.
• Prior involvement with industry standards (OCP, PCIe) a plus.

Responsibilities

• Support AI and data center customers in design, development, and integration of Amphenol power connector solutions.
• Translate customer specifications into interconnect designs with internal teams.
• Provide technical leadership in power delivery standards and participate in relevant groups.
• Drive innovation in connector technologies for high-current, low-resistance, high-reliability needs.
• Partner with sales and business development to inform design-in and qualification phases.
• Conduct field validation, performance testing, and troubleshooting at sites or labs.
• Voice the customer to shape future product roadmaps and tech direction.
• Maintain awareness of AI hardware trends, rack density, and modular architectures.

Skills

Power electronics

High-current interconnects

Thermal management

CAD tools

Electrical schematics interpretation

Microsoft Office

Engineering simulation tools

Travel up to 50%

Education

Bachelor's degree in Electrical, Mechanical, or Mechatronic Engineering

Master's degree preferred

Tools

Creo

SolidWorks

AutoCAD

Job description

Amphenol Industrial Operations, headquartered in Endicott, New York, with global manufacturing, design, sales, and marketing locations, specializes in delivering a comprehensive range of high-reliability power and signal connectors along with interconnection systems designed specifically for harsh environments and high performance. Our solutions cater to diverse, high-growth industrial sectors such as alternative energy, energy storage, hyperscale datacom, telecom, rail and mass transit, electric and hybrid vehicles, transportation, factory automation, robotics, and heavy equipment.

Our product portfolio addresses modern power and signal requirements and emerging system technology needs encompassing high-amperage power interconnects utilizing proprietary RADSOK® contact technology, ruggedized circular, rectangular interconnects and board level contacts (GT, AC, PT, Amphe-Lite, Radsert, PowerBlok, SurLok Plus, ePower, UPC, H4 Plus, and more), advanced power distribution including value-add box builds, custom-engineered cable assemblies and overmolded harnesses. With a dedicated team of over 2500 skilled staff operating across a growing international footprint—including eight key manufacturing sites in North America, Asia‑Pacific, Europe, and the Middle East providing localization for our customer base.Amphenol Industrial Operations consistently meets the highest global standards of quality, product performance, design capabilities, and regionalized technical and sales support.

Amphenol Industrial Operations proudly operates as a business unit of Amphenol Corporation (NYSE: APH), a global leader in the electronics revolution, headquartered in Wallingford, Connecticut.

Role Description

The Field Application Engineer (FAE) – Power Interconnects will provide technical support and application expertise across North America for Amphenol’s power-to-board and power-to-rack connector solutions and liquid cooling used in AI server, data center, and high-performance computing (HPC) applications. This individual will be a key technical interface between customers, sales, and product development teams, ensuring that Amphenol’s interconnect technologies meet the evolving power distribution needs of next‑generation AI architectures.

The role includes collaboration with hyperscale, OEM, and rack integration customers, as well as participation in industry initiatives related to high-density power delivery and AI system infrastructure standards.You will be expected to develop new business and drive new product development needs to meet the markets' technology trends, by working internally with global Product Management, Business Development and Engineering.

• Support AI and data center customers in the design, development, and integration of Amphenol power connector solutions into rack, server, and board‑level systems.
• Translate customer specifications and requirements into interconnect designs, collaborating closely with internal engineering and manufacturing teams.
• Provide technical leadership in power delivery standards and participate in relevant working groups (e.g., OCP, ODCC, or hyperscaler‑specific initiatives).
• Drive innovation in connector technologies for high-current, low-resistance, and high-reliability applications.
• Partner with sales and business development to provide technical insight during design‑in and qualification phases.
• Conduct field validation, performance testing, and troubleshooting at customer sites or Amphenol labs.
• Act as the voice of the customer to inform future product roadmap and technology direction.
• Maintain up-to-date awareness of AI hardware trends, including rack density, power efficiency, and modular architecture developments.

Qualifications

Education & Experience Requirements

• Bachelor’s degree in Electrical, Mechanical, or Mechatronic Engineering (Master’s preferred).
• 3–7 years of experience in connector design, power electronics, or related hardware integration roles.
• Experience in AI data centers, rack power distribution, cooling systems, or server platform engineering strongly preferred.
• Customer‑facing or field engineering experience required.
• Prior involvement with industry standards or consortiums (OCP, PCIe, or similar) a plus.
• Familiarity with AI compute racks, GPU servers, and power delivery architectures (e.g., 48V, blind‑mate power, busbars) highly desirable.

Skills and Knowledge

• Location in or near Bay area (CA)
• Prefer candidate come from Data Center company focus on hardware.
• Deep technical understanding of power electronics, high-current interconnects, and thermal management.
• Proficiency in electrical and mechanical CAD tools (e.g., Creo, SolidWorks, AutoCAD).
• Working knowledge of electrical performance metrics such as current carrying capacity, contact resistance, derating, and impedance.
• Ability to interpret electrical schematics, 3D models, and mechanical drawings.
• Strong interpersonal, presentation, and communication skills for customer and cross‑functional engagement.
• Proficiency with Microsoft Office.
• Proficiency in engineering simulation tools (e.g., ANSYS, SPICE, or equivalent) nice to have.
• Ability to travel domestically and internationally up to 50%.Significant travel in Bay Area (CA)

The physical requirements described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. While performing the duties of this job, the employee is regularly required to talk, hear, sit, stand; walk; and use hands to finger, handle, or feel. Must be able to sit and/or stand for long periods of time. Ability to work in labs, at customer sites, and with hands‑on equipment. Occasional lifting of samples/equipment (up to 50 lbs).Regular domestic travel and occasional international travel.

• HSA, FSA
• 401k with company matching program
• Management by Objectives (MBO) Incentive Program