FAB Device Engineer Intern - Summer 2027

NXP Semiconductors; Town of Montana (WI); On-site; USD 31,000 - 36,000; Full time

Job summary

NXP Semiconductors in Austin (Ed Bluestein, Office) seeks an electrical engineering-minded intern to assist in parametric yield improvements and process control. You will contribute to integration changes to reduce costs and enhance device functionality while collaborating with a team on various microelectronics projects.

Ideal candidates are pursuing an Electrical Engineering degree, with familiarity in device parametrics, microfabrication, materials analysis, and statistical quality methods.

Qualifications

• Pursuing electrical engineering degree or related technical field with relevant experience.
• Familiarity with device parametric extraction, MOS/BJT, microfabrication, and metrology.
• Experience in microelectronics-related tasks via co-op or internship is preferred.
• Lab data tools such as JMP, PROMIS, SQL, or LabView are beneficial.
• Graduate by July 2027 or be returning to school after internship.

Responsibilities

• Enhance functional yield via wafer probe as part of the internship.
• Maintain and improve parametric process control for device performance.
• Develop integration changes to reduce cost or improve device functionality.
• Work independently and in team-based projects with problem-solving focus.
• Apply electrical testing, data analyses, and materials metrology concepts.

Skills

Electrical engineering degree

Parametric extraction methods

MOS/BJT device operation

Microfabrication concepts

Materials analysis techniques

Statistical analysis

LabView experience

SQL / JMP / PROMIS tools

Education

Electrical engineering degree

Tools

LabView

JMP

PROMIS

SQL

Job description

Job Location

Austin (Ed Bluestein, Office)

Time Type

Full time

Job Summary

Primary responsibilities include functional yield enhancement (wafer probe), maintaining and improving parametric process control, developing integration changes to reduce cost or enhance device functionality.

Should have demonstrated abilities to work independently and work within a team-based project environment. Should have keen interest in problem-solving using electrical testing, physical analyses, and statistical data analyses.

Specific projects may include a facet of integration development or integration optimization.

Job Qualifications

• Working toward an Electrical engineering degree is required or in another technical field with related experience (Chemical engineering, Materials science).
• Classroom and/or lab familiarity with some of the following:
  • Device parametric extraction methods
  • Discrete device operation (MOS, BJT)
  • Microfabrication and unit process integration concepts
  • Key statistical analysis and control concepts
  • Materials analysis techniques
  • Materials metrology operation and techniques.
• Preferable would be previous educational, research, or industrial experience (co-op or internship) applying Solid State Physics, Electrical Engineering, Electronic Materials principles to microelectronics-related tasks.
• Experience in JMP, PROMIS, SQL, LabView or bench probe characterization is a plus.
• In order to be considered for a summer internship with NXP you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027 please apply to Entry Level full-time roles.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.