EV Thermal Firmware Engineer (Hands-on)

Ford; Palo Alto (CA); On-site; USD 28,000 - 56,000; Full time

Benefits offered by this job

Relocation stipend

Onsite four days per week

Job summary

Ford Motor Company in California invites undergrad engineers to join a 6-month Early Career Program in Thermal Firmware Integration. You’ll work at the boundary between thermal hardware and embedded software, supporting bring-up, integration, verification, and hands-on debugging on real hardware.

You will read and trace embedded C, collaborate with cross-functional teams, and develop tests for sensors, actuators, and diagnostics.

Qualifications

• Pursuit of an engineering degree or current student in a related field.
• Solid grounding in mechatronic fundamentals and embedded software interaction.
• Ability to read, trace, and debug C/C++ on embedded targets.
• Demonstrated debugging and diagnostic ability across electrical, mechanical, and software domains.
• Hands-on lab experience building test setups and collecting data.
• Excellent analytical and communication skills; collaborative mindset.
• GPA 3.0 on a 4.0 scale; 6 months commitment required.

Responsibilities

• Support bench bring-up and integration of thermal mechatronic devices.
• Build and instrument prototype bench setups for firmware integration testing.
• Write and execute verification tests for controls, logic, and diagnostics.
• Analyze CAN, LIN, and Automotive Ethernet traces and vehicle logs.
• Read and trace embedded C to understand implemented behavior.
• Support sensor/actuator characterization across operating conditions.
• Verify diagnostic trouble codes and manufacturing self-test behavior.
• Document interfaces, test setups, and known issues in Jira

Skills

Mechatronics basics

Embedded C/C++

Debugging & diagnostics

Analytical skills

Lab/test setups

Team collaboration

Education

Engineering degree or pursuing degree in Mechatronics/Mechanical/Electrical/CS

Tools

Jira

Confluence

Git

CANalyzer

CANoe

CANape

Job description

Ford Motor Company in California invites undergrad engineers to join a 6-month Early Career Program in Thermal Firmware Integration. You’ll work at the boundary between thermal hardware and embedded software, supporting bring-up, integration, verification, and hands-on debugging on real hardware.

You will read and trace embedded C, collaborate with cross-functional teams, and develop tests for sensors, actuators, and diagnostics.