Etch Process Engineering Lead — Yield & Innovation

TSMC; Camas (WA); On-site; USD 108,235 - 156,729; Full time

Benefits offered by this job

Medical, dental, and vision insurance

401(k) plan with employer match

Employee stock purchase program

Paid time off

On-site fitness center

Job summary

TSMC in Camas, Washington, is seeking a Principal Process Engineer to enhance wafer yield in semiconductor manufacturing. The role involves heavy data analysis, cross-functional collaboration, and process optimization to drive cutting-edge technology forward.

Candidates should possess a relevant degree and over five years of experience in a semiconductor fab. This position offers a hybrid work model, competitive salary, and comprehensive benefits.

Qualifications

• 5+ years of etch process experience in a high-volume semiconductor fab.
• Strong understanding of etch process principles and troubleshooting.
• Ability to use SPC and real-time monitoring methods.

Responsibilities

• Perform data analysis using SPC to monitor process performance.
• Collaborate with cross-functional teams for technology transfer.
• Manage flexible personal time for business requirements.

Skills

Data analysis capability

Multi-tasking skills

Project management skills

Communication skills

Education

BS or higher in Chemical Engineering, Chemistry, Electrical Engineering, Physics, or Material Science

Job description

TSMC in Camas, Washington, is seeking a Principal Process Engineer to enhance wafer yield in semiconductor manufacturing. The role involves heavy data analysis, cross-functional collaboration, and process optimization to drive cutting-edge technology forward.

Candidates should possess a relevant degree and over five years of experience in a semiconductor fab. This position offers a hybrid work model, competitive salary, and comprehensive benefits.