Equipment Engineer Intern — TPM & AI-Driven Upgrades

Micron Technology, Inc; Boise, Northern (ID, KY); Hybrid; USD 34,000 - 48,000; Part time

Job summary

Micron Technology, Inc. in Boise, Idaho invites a motivated student to join our ID1 Equipment Engineering internship.

You will monitor, sustain, and improve semiconductor equipment in the fabrication facility, partnering with process engineers and technicians. This hands-on role emphasizes TPM, MTAG, and data-driven problem solving, with exposure to SPC, DOE, and AI-enabled analytics to drive tool uptime and yield.

Qualifications

• Currently pursuing a degree in Electrical or Mechanical Engineering and enrolled through September 2026.
• Experience with programming or data analysis tools (Python/Java/Tableau/MATLAB) is preferred.
• Familiarity with schematic diagrams, electronics, and mechanical systems is helpful.

Responsibilities

• Monitor, sustain, and improve semiconductor equipment in the fabrication facility.
• Supervise tool performance, schedule preventive maintenance, and document activity.
• Collaborate with process engineers and technicians to resolve issues affecting uptime and yield.
• Assist with equipment installations, tests, and updating procedures and training materials.
• Apply TPM, MTAG, and data-driven methods to reduce downtime and defects.
• Utilize SPC/DOE and structured problem solving to improve process control.

Skills

Python

Java

Tableau

MATLAB

Microsoft Office

Education

Electrical Engineering or Mechanical Engineering (enrolled)

Job description

Micron Technology, Inc. in Boise, Idaho invites a motivated student to join our ID1 Equipment Engineering internship.

You will monitor, sustain, and improve semiconductor equipment in the fabrication facility, partnering with process engineers and technicians. This hands-on role emphasizes TPM, MTAG, and data-driven problem solving, with exposure to SPC, DOE, and AI-enabled analytics to drive tool uptime and yield.