Equipment Development Engineer – Wafer Bonding - Technology Development Group

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 150,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking an Equipment Development Engineer for Wafer Bonding to own equipment development from concept through manufacturing, collaborating with suppliers and cross-functional teams.

The role focuses on wafer bonding, alignment, overlay, modeling, automation, and data analytics to push capabilities forward; requires a B.S. in Mechanical Engineering and 4+ years in semiconductor equipment.

Qualifications

• Bachelor's degree in Mechanical Engineering and 4+ years in semiconductor equipment or related engineering.
• Ability to troubleshoot complex equipment, analyze data, and drive projects to completion.
• Experience with precision alignment, overlay, modeling, or complex electromechanical systems.

Responsibilities

• Own wafer bonding equipment performance, capability, reliability, availability and productivity.
• Lead FAOK equipment, hardware, and subsystem development with suppliers.
• Drive improvements in overlay, alignment, bond-wave behavior, tool matching, and contamination control.
• Develop equipment requirements, performance budgets, experiments, simulations, and data-driven solutions.
• Use modeling, automation, and data to understand system behavior and find opportunities.
• Lead equipment evaluations, installations, qualifications, upgrades, and major improvements.

Skills

precision alignment

overlay

modeling

Python

MATLAB

electromechanical systems

Education

Bachelor's degree in Mechanical Engineering

Tools

SECS/GEM

Automation equipment

Job description

Equipment Development Engineer – Wafer Bonding

Req ID: JR114706 Equipment Development Engineer – Wafer Bonding - Technology Development Group

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We’re looking for an engineer who wants to build what comes next!

As an Equipment Development Engineer on Micron’s Wafer Bonding Equipment Development team, you’ll help develop next-generation, first-of-a-kind (FAOK) wafer bonding equipment. We take new ideas from concept to hardware, work directly with equipment suppliers to push system capability, and ultimately put those solutions into technology development and manufacturing.

This is a hands‑on development role with significant technical ownership. You’ll work on precision alignment, overlay, bonding, controls, mechanical systems, automation, equipment data, and new hardware. When today’s equipment can’t meet tomorrow’s requirements, we figure out why and develop a solution!

You’ll work closely with process development, manufacturing, suppliers, and engineering teams across Micron. Together, we’ll solve difficult equipment problems, develop new capabilities, and define the equipment roadmap required for future generations of Micron technology.

What You’ll Do

You’ll own important equipment‑development challenges from initial concept through manufacturing implementation. That includes developing new equipment and subsystems with suppliers, evaluating new technologies, qualifying hardware, solving difficult equipment problems, and continuously improving tool capability.

You will also:

• Own wafer bonding equipment performance, capability, reliability, availability, and productivity
• Lead FAOK equipment, hardware, and subsystem development with our suppliers
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements
• Help define our wafer bonding equipment and technology roadmap
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team
• Demonstrate AI proficiency and utilize AI‑enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

What We’re Looking For

We’re looking for engineers who enjoy difficult technical problems and want responsibility for solving them.

You should have a bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field, along with 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.

You should be comfortable troubleshooting complex equipment, analyzing data, working across engineering disciplines, and driving technical projects to completion. Experience with precision alignment, overlay, modeling, or complex electromechanical systems is highly valued.

Even Better If You Bring

• Experience with wafer-to-wafer fusion or hybrid bonding
• Precision alignment and overlay
• Motion control
• Semiconductor equipment development
• Python or MATLAB
• Equipment data and SECS/GEM
• Sensors and automation
• FEA, DOE, PCA, or other modeling techniques
• Direct development work with semiconductor equipment suppliers
• MS or PhD and experience leading technical programs across multiple organizations, suppliers, or sites

Travel

Approximately 5–10% domestic and international travel may be required for supplier development and cross‑site engineering collaboration.

Job Profile(s)

Equipment Engineer 4

Relocation Level: TBD

Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Contact

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)