Engineer Sales \"Technical\"

SPIRIT ELECTRONICS; Phoenix (AZ); On-site; USD 140,000 - 190,000; Full time

Job summary

Spirit Electronics seeks an Engineer Sales "Technical" to accelerate growth across advanced microelectronics engineering, backend foundry services, custom assembly, and MIL-STD testing. You will bridge Spirit’s engineering team and clients, translating backend architectures into compelling value propositions.

You will cultivate Tier 1 aerospace, defense, automotive, and medical accounts, lead technical engagements, and drive complex deals while aligning with internal IC Packaging, Test

Qualifications

• 5+ years in technical sales, sales engineering, or applications engineering selling high-reliability components or backend services.
• Deep semiconductor/microelectronics background required.
• Experience with aerospace/defense/medical device or EV sensor domains is a plus.

Responsibilities

• Develop and expand strategic technical relationships with Tier 1 aerospace, defense, automotive, and medical device accounts.
• Conduct technical presentations, capabilities briefings, and tours of capabilities.
• Collaborate with IC Packaging, Test Engineering, and Program Management to design customized back-end workflows.
• Own technical sales lifecycle from discovery to RFP mapping to contract closure.
• Stay abreast of MIL-STD and other standards to position Spirit as a leading backend partner.

Skills

Strategic account development

Value-driven selling

Solution architecture

Deal execution/RFP capture

Market intelligence

Pipeline management

Education

Bachelor’s degree in Electrical/Mechanical Engineering or Materials Science

Tools

CRM/ERP platforms

MS Excel

Job description

About this position

Spirit is seeking a high-caliber Engineer Sales \"Technical\" to accelerate the growth of our advanced microelectronics engineering, backend foundry services, custom assembly, and MIL-STD testing business units. This is not a transactional, off-the-shelf component sales role. You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital technical bridge between Spirit’s internal engineering team and our clients, you will translate complex backend architectures into bulletproof value propositions. Your primary focus will be capturing market share in hyper-stringent industries where failure is not an option: Aerospace & Defense, Automotive (EV Sensors & Qualification), Medical Devices, and Advanced MEMS / Micro-electronic Modules.

Essential Job Functions

• Strategic Account Development: Cultivate and expand deep-level technical relationships with Tier 1 aerospace, defense, automotive, and medical device accounts.
• Value-Driven Technical Selling: Conduct technical presentations, capabilities briefings, and facility tours showcasing Spirit’s sophisticated foundry services, advanced packaging/assembly, and MIL-STD qualification testing.
• Collaborative Solution Architecting: Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets.
• Deal Execution & RFP Capture: Own the technical sales lifecycle for complex engineering services—from initial technical discovery and RFP/RFQ mapping to negotiating high-value contracts and closing deals.
• Market Intelligence & Technical Leadership: Stay ahead of evolving industry standards (AEC-Q100, MIL-STD-883/750, ISO 13485) to position Spirit as the premier high-reliability backend partner. Represent the company at key semiconductor and aerospace trade shows.
• Pipeline Management: Maintain an accurate, data-driven sales pipeline using CRM tools, working in lockstep with Corporate Sales and Business Development to align with

Requirements

• Industry Experience: 5+ years of successful Technical Sales, Sales Engineering, or Applications Engineering experience, specifically selling high-reliability components, semiconductor backend services (OSAT), micro-electronics packaging, or complex testing services.
• Technical Foundation: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A strong semiconductor/microelectronics background is required.
• High-Rel Domain Expertise: High familiarity with the requirements of mission-critical ecosystems:
  • Components & Packaging: Solid understanding of EEE components, wafer bumping, wire bonding, flip-chip, MEMS, and EV sensors.
  • Standards: Deep familiarity with MIL-STD testing procedures, with a strong understanding of what it takes to qualify hardware for extreme environments (AEC-Q100, IATF 16949, ISO 13485).
  • Supply Chain: Familiarity with supply chain logistics and inventory management concepts unique to aerospace, defense, and high-reliability manufacturing.
• Commercial Track Record: Proven ability to meet or exceed quotas in long-cycle, high-value, highly technical B2B or government sales environments.
• Elite Communication: Ability to code-switch effortlessly—speaking \"physics-of-failure\" with a customer's packaging engineer, and \"ROI/Timeline\" with their procurement director.
• Tools & Travel: Proficiency in CRM/ERP platforms and MS Excel. Willingness to travel for face-to-face customer engineering reviews and industry events.

Why Join Spirit?

• High-Value, High-Stakes Portfolio: You won't be competing on pennies per unit for commoditized chips. You will sell high-margin, critical engineering and qualification solutions that protect mission-critical applications.
• Collaborative Culture: Work alongside brilliant engineering minds in an agile environment where your technical field input directly shapes our service roadmap and future capabilities.