Embedded Hardware Engineer: Low-Power MCU/FPGA & Bluetooth

Stratos Card; Ann Arbor (MI); On-site; USD 90,000 - 130,000; Full time

Job summary

Stratos, Inc. is seeking an Embedded Hardware Engineer to develop the hardware platform for a pay­ment technology, integrating MCU, FPGA, Bluetooth, sensors, encryption, and power‑management.

You will work with firmware, manufacturing, and mechanical teams to ensure testability, manufacturability, and robust performance across multiple platforms. Expect occasional international travel as needed.

Qualifications

• Experience creating design specification documents and performing circuit analyses.
• Experience with verification, testing, and QA of deliverables against specs and requirements.
• Board bring up, programming, and debugging MCU-based systems.
• Experience with debugging tools like bus analyzers and oscilloscopes.
• Knowledge of flexible electronics design.

Responsibilities

• Design and implementation of the hardware platform for a new payment technology, including MCU, FPGA, Bluetooth Smart, touch sensors, encryption, security, low power.
• Collaborate with firmware engineers on design, self-test, and implementation.
• Collaborate with manufacturing and mechanical engineers for test, manufacturing, failure analysis, and yield improvements.
• Design programming and manufacturing jigs for uncommon form factor.
• Support and review of 3rd party design projects.
• Root cause analysis for initial design and manufacturing issues.
• International travel on occasion.

Skills

Design specification

Schematic analysis

Education

BS/MS in Electrical Engineering/Computer Engineering

Tools

Altium Designer

PCB layout and design

SPICE analysis

Bus analyzers

Oscilloscopes

Job description

Stratos, Inc. is seeking an Embedded Hardware Engineer to develop the hardware platform for a pay­ment technology, integrating MCU, FPGA, Bluetooth, sensors, encryption, and power‑management.

You will work with firmware, manufacturing, and mechanical teams to ensure testability, manufacturability, and robust performance across multiple platforms. Expect occasional international travel as needed.