EnaChip: Electroplating Engineer

Anzu Partners; Philadelphia (Philadelphia County); On-site; USD 90,000 - 115,000; Full time

Job summary

EnaChip is seeking an Electroplating Engineer to define, optimize, and own the electroplating steps as we scale from R&D to wafer- and panel-level production. You will work onsite in Philadelphia alongside a growing team, shaping magnetics integration within semiconductor fabrication processes.

Ideal candidates have 3–5 years in electroplating within semiconductor/manufacturing, strong batch chemistry knowledge, and a proven ability to own process development end-to-end.

Qualifications

• 3-5 years of experience with electroplating/electrochemical deposition in a semiconductor or advanced manufacturing environment.
• Experience with multiple power supply types, bath metrology/monitoring equipment, SPC/DOE and related software (JMP).
• Knowledge of plating bath chemistry, current density optimization, and thin-film characterization.
• A strong process-ownership mindset — you define it, you build it, you scale it

Responsibilities

• Develop and optimize electroplating processes for magnetic alloy deposition.
• Characterize processes, improve yield, and integrate electroplating with semiconductor fabrication flows.
• Scale electroplating processes from R&D to wafer- and panel-level production.
• Collaborate with materials and design teams to tune conductor and magnetic layer properties.

Skills

Electroplating

Semiconductor processing

DOE

SPC

JMP

Thin-film characterization

Process ownership

Current density optimization

Education

Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field

Tools

JMP

Job description

Electroplating Engineer

Philadelphia, PA

About EnaChip

EnaChip is building a new foundation for power delivery—bringing together advances in materials science, semiconductor processing, and system architecture. Our mission is to remove power delivery as a constraint on technological progress, enabling the next generation of compute systems to reach higher performance, efficiency, and scale.

The Opportunity

EnaChip is looking for an Electroplating Engineer who wants to define, optimize, and own the electroplating process. This is an opportunity to scale a process from R&D to wafer- and panel-level production, working at the leading edge of a platform that's bringing magnetics directly into the semiconductor stack. You'll join a young, growing team, with real opportunities to move into a leadership role as the company scales. This position will work onsite in Philadelphia.

Key Responsibilities

• Develop and optimize electroplating processes for magnetic alloy deposition
• Characterize processes, improve yield, and integrate electroplating with semiconductor fabrication flows
• Scale electroplating processes from R&D to wafer- and panel-level production
• Collaborate with materials and design teams to tune conductor and magnetic layer properties

Qualifications

• Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field
• 3-5 years of experience with electroplating/electrochemical deposition in a semiconductor or advanced manufacturing environment
• Experience with multiple power supply types, bath metrology/monitoring equipment, SPC/DOE and related software (JMP), and thin-film characterization
• Knowledge of plating bath chemistry, current density optimization, and thin-film characterization
• A strong process-ownership mindset — you define it, you build it, you scale it

Nice to Have

• Experience in a startup or early-stage hardware environment

Compensation

• Base salary range: $90,000–$115,000, commensurate with experience and qualifications
• Total compensation includes equity in a rapidly growing start-up

EnaChip is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other legally protected characteristic.