Electronics Packaging Mechanical Engineer (Remote 2 Days/Week)

ASML Berlin GmbH

Wilton (CT)

On-site

USD 110,000 - 160,000

Full time

10 days ago
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Benefits offered by this job

Health insurance
Dental insurance
Vision insurance
401k plan
Vacation time
13 paid holidays

Job summary

ASML is seeking a Mechanical Engineer - Electronics Packaging to specify, design, develop, realize, integrate, and test modules and tools in a multi-disciplinary team. You will lead complex parts of modules and deliver technically advanced solutions with full ownership, collaborating with suppliers and cross-functional teams.

Role emphasizes design, test, integration, and verification across module and system levels, with a focus on manufacturability and interface alignment.

Qualifications

  • Bachelor's degree in Mechanical or Electrical Engineering.
  • MS or PhD preferred.
  • Minimum four years of relevant work experience.

Responsibilities

  • Identify, analyze, document, and manage requirements with traceability; coordinate verification criteria.
  • Conduct research and feasibility studies; translate results into recommendations and decisions.
  • Develop concepts and solutions; resolve issues to meet functionality, performance, cost, and compliance needs.
  • Define and communicate specifications and high-level designs; align interfaces and support reviews.

Skills

Mechanical design
Electrical packaging
NX CAD
DFM
V&V

Education

Bachelor's degree in Mechanical or Electrical Engineering
MS or PhD preferred

Tools

NX
Teamcenter
SAP

Job description

ASML is seeking a Mechanical Engineer - Electronics Packaging to specify, design, develop, realize, integrate, and test modules and tools in a multi-disciplinary team. You will lead complex parts of modules and deliver technically advanced solutions with full ownership, collaborating with suppliers and cross-functional teams.

Role emphasizes design, test, integration, and verification across module and system levels, with a focus on manufacturability and interface alignment.

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