Electronics Packaging Engineer - Power and Thermal Systems

Karman Industries; Los Angeles (CA); Sur place; USD 110 000 - 150 000; Plein temps

Résumé du poste

Karman Industries in Gardena, California is seeking a Mechanical Engineer, Electronics Packaging to lead the design of packaging for power electronics, inverters, drives, and high-frequency transformers enabling the Heat Processing Unit. You will address mounting, isolation, heat transfer, and manufacturability with a strong first-principles approach.

You will collaborate across disciplines to optimize packaging systems, work with thermal and manufacturing teams, and develop robust, scalable

Qualifications

• B.Sc. in mechanical engineering is required.
• 3+ years of experience in packaging for electrical hardware.
• Hands-on experience with enclosures and electrical connectors.
• Knowledge of basic DFM practices.
• Self-motivated with strong communication and multitasking abilities.

Responsabilités

• Define electronics packaging strategies for power electronics systems.
• Design mounting and isolation systems for PCBs and assemblies.
• Collaborate with manufacturing to identify viable fabrication methods.
• Coordinate with thermal analysis to address thermal/mechanical factors.
• Integrate thermal, mechanical, and electrical designs into cohesive products.
• Develop novel, first-principles models to assess hardware performance.
• Work with a cross-disciplinary team to ensure manufacturability.

Connaissances

Packaging design

Electrical packaging

DFM knowledge

Self-management

Formation

B.Sc. in mechanical engineering

Description du poste

Karman Industries in Gardena, California is seeking a Mechanical Engineer, Electronics Packaging to lead the design of packaging for power electronics, inverters, drives, and high-frequency transformers enabling the Heat Processing Unit. You will address mounting, isolation, heat transfer, and manufacturability with a strong first-principles approach.

You will collaborate across disciplines to optimize packaging systems, work with thermal and manufacturing teams, and develop robust, scalable