Electrical Engineering Intern: Embedded Systems & AI

HP; Corvallis (MT); On-site; USD 40,000 - 48,000; Full time

Benefits offered by this job

Health insurance

Dental insurance

Vision insurance

Long term/short term disability

Employee assistance program

Flexible spending account

Life insurance

Generous time off policies

4-12 weeks parental leave

13 paid holidays

15 days paid time off

Job summary

HP, Inc. is offering a 12-week paid Summer Internship to students who can contribute to hardware and firmware projects, including UEFI/BIOS work on HP Workstations and AI model data collection. The role emphasizes learning by doing on real-world hardware challenges.

The program aims at potential conversion to a full-time role, with performance-based evaluation and no future sponsorship commitment. Eligible candidates must be able to work in the United States in 2027 without sponsorship.

Qualifications

• 3rd Year of University completed or 1st year of Masters completed—technical degree focus.
• Able to obtain U.S. work authorization in 2027 and not require future sponsorship.
• Experience with HP hardware or embedded systems is a plus.

Responsibilities

• Work on UEFI/BIOS related projects for HP Workstations.
• Troubleshoot complex hardware/software issues and gather training data for AI models.
• Collaborate with engineering teams on design and validation tasks.

Skills

Circuit analysis

Analog electronics

Digital electronics

PCB design

Schematic capture

Oscilloscope usage

Multimeter usage

Logic analyzer

Embedded systems

Digital logic

Power electronics basics

Education

Electrical Engineering

Computer Engineering

Electrical and Computer Engineering

Electronics Engineering

Mechatronics Engineering

Systems Engineering

Physics

Computer Science

Job description

HP, Inc. is offering a 12-week paid Summer Internship to students who can contribute to hardware and firmware projects, including UEFI/BIOS work on HP Workstations and AI model data collection. The role emphasizes learning by doing on real-world hardware challenges.

The program aims at potential conversion to a full-time role, with performance-based evaluation and no future sponsorship commitment. Eligible candidates must be able to work in the United States in 2027 without sponsorship.