Electrical Engineer, Robotics & High-Density PCBs

Persona AI Inc; Georgia; On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Competitive pay

Bonus

Medical benefits

Equity

PTO

Winter break

Job summary

Persona AI Inc. is seeking an Electrical Engineer to design space- and performance-constrained electronics for humanoid robots used in heavy industry. You will architect, schematic, layout, fab, and bring-up boards, ensuring high-density, robust electronics for motors, sensors, and compute subsystems.

You will collaborate with firmware and software teams to ensure boards enable control stacks, while advancing HDI techniques and chip-scale packaging in a fast-moving hardware group.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field.
• 5+ years of industry experience designing and shipping production electronics.
• Experience with highly integrated PCBAs and rigid-flex assemblies.

Responsibilities

• Design and support hardware architecture of PCBAs and rigid-flex circuits.
• Select components and stackups for power management and motor control.
• Co-design with mechanical engineers for fit in CAD models.
• Support mixed-signal subsystems including sensors and compute.
• Contribute to SI/PI analysis, thermal, and EMI/EMC considerations.
• Bring up boards with debugging using scope/LA, iterate on layout.

Skills

PCB design

HDI techniques

mixed-signal design

high-speed signals

fault finding

embedded C

Education

Bachelor’s degree in Electrical Engineering

Advanced degree a plus

Tools

KiCAD

Altium

Cadence Allegro

Job description

Persona AI Inc. is seeking an Electrical Engineer to design space- and performance-constrained electronics for humanoid robots used in heavy industry. You will architect, schematic, layout, fab, and bring-up boards, ensuring high-density, robust electronics for motors, sensors, and compute subsystems.

You will collaborate with firmware and software teams to ensure boards enable control stacks, while advancing HDI techniques and chip-scale packaging in a fast-moving hardware group.